This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

The classes of tool materials for machining operations are high-speed tool steels, carbides, cermets, ceramics, polycrystalline cubic boron nitrides, and polycrystalline diamonds. This article discusses the expanding role of surface engineering in increasing the manufacturing productivity of carbide, cermet, and ceramic cutting tool materials used in machining operations. The useful life of cutting tools may be limited by a variety of wear processes, such as crater wear, flank wear or abrasive wear, builtup edge, depth-of-cut notching, and thermal cracks. The article provides information on the applicable methods for surface engineering of cutting tools, namely, chemical vapor deposited (CVD) coatings, physical vapor deposited coatings, plasma-assisted CVD coatings, diamond coatings, and ion implantation.

This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD reactions of materials related to hard, tribological, and high-temperature coatings and to free-standing structures. It concludes by reviewing the advantages, disadvantages, and applications of CVD.