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A.T. Santhanam, D.T. Quinto
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Hugh O. Pierson
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Prabha K. Tedrow, Rafael Reif
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Plasma-enhanced chemical vapor deposition
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Book Chapter
Surface Engineering of Carbide, Cermet, and Ceramic Cutting Tools
Available to PurchaseBook: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001320
EISBN: 978-1-62708-170-2
Abstract
The classes of tool materials for machining operations are high-speed tool steels, carbides, cermets, ceramics, polycrystalline cubic boron nitrides, and polycrystalline diamonds. This article discusses the expanding role of surface engineering in increasing the manufacturing productivity of carbide, cermet, and ceramic cutting tool materials used in machining operations. The useful life of cutting tools may be limited by a variety of wear processes, such as crater wear, flank wear or abrasive wear, builtup edge, depth-of-cut notching, and thermal cracks. The article provides information on the applicable methods for surface engineering of cutting tools, namely, chemical vapor deposited (CVD) coatings, physical vapor deposited coatings, plasma-assisted CVD coatings, diamond coatings, and ion implantation.
Book Chapter
Chemical Vapor Deposition of Nonsemiconductor Materials
Available to PurchaseBook: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001283
EISBN: 978-1-62708-170-2
Abstract
This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD reactions of materials related to hard, tribological, and high-temperature coatings and to free-standing structures. It concludes by reviewing the advantages, disadvantages, and applications of CVD.
Book Chapter
Plasma-Enhanced Chemical Vapor Deposition
Available to PurchaseBook: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001285
EISBN: 978-1-62708-170-2
Abstract
This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.