Powder-bed fusion (PBF) is a group of additive manufacturing (AM) processes that includes selective laser sintering, selective laser melting, and electron beam melting. This article explains the processes and parameters of PBF systems that are used for biomedical applications. It also presents the desirable properties of biomedical devices and the advantages of using PBF systems for biomedical applications.

Fusion-based additive manufacturing (AM) processes rely on the formation of a metallurgical bond between a substrate and a feedstock material. Energy sources employed in the fusion AM process include conventional arcs, lasers, and electron beams. Each of these sources is discussed, with an emphasis on their principles of operation, key processing variables, and the influence of each source on the transfer of heat and material. Common energy sources used for metals AM processes, particularly powder-bed fusion and directed-energy deposition, are also discussed. Brief sections at the end of the article discuss the factors dictating the choice of each of these energy sources and provide information on alternative sources of AM.

The additive manufacturing technologies in the casting of precious metals are divided into two groups: indirect metal methods and direct metal methods. Besides providing a process overview of both of these methods, the focus of this article is on the characteristics, process steps, applications, and advantages of direct metal methods, namely laser melting, material extrusion, binder jetting, material jetting, and vat photopolymerization methods.

Tungsten, molybdenum, and cemented carbide parts can be produced using several additive manufacturing technologies. This article classifies the most relevant technologies into two groups based on the raw materials used: powder-bed methods, such as selective laser melting, electron beam melting, and binder jet three-dimensional (3-D) printing, and feedstock methods, such as fused-filament fabrication and thermoplastic 3-D printing. It discusses the characteristics, processing steps, properties, advantages, limitations, and applications of these technologies.