This article discusses the various methods for evaluating the quench sensitivity of aluminum alloys, namely, time-temperature-property diagrams, the quench factor analysis, the Jominy end-quench method, and continuous-cooling precipitation diagrams. It briefly describes the procedures, applications, advantages, and limitations of these methods.

Quenching is a widely used technique to strengthen titanium alloys. This article presents the metallurgical and structural background underlying the specific techniques applied in the quenching of various titanium alloys, and the ways to control and reduce residual stresses induced from quenching or other thermal or mechanical processes. It discusses the types and microstructures of titanium alloys, namely, alpha, alpha-beta, and beta alloys, and describes the general effects of the various heat treatments. The article provides information on quenching media, quenching rate, section size, and martensitic transformation in quenched titanium alloys. It shows how residual stresses in titanium alloys are evaluated and controlled. Finally, the article describes the stress-relief treatments used to reduce residual stresses.

Hardenability refers to the ability of steel to obtain satisfactory hardening to some desired depth when cooled under prescribed conditions. It is governed almost entirely by the chemical composition (carbon and alloy content) at the austenitizing temperature and the austenite grain size at the moment of quenching. This article describes the Jominy end-quench test, the Grossman method, and the air hardenability test to evaluate hardenability. It also reviews the factors that influence steel hardenability and selection.

Scanning electron microscopy (SEM) has shown various significant improvements since it first became available in 1965. These improvements include enhanced resolution, dependability, ease of operation, and reduction in size and cost. This article provides a detailed account of the instrumentation and principles of SEM, broadly explaining its capabilities in resolution and depth of field imaging. It describes three additional functions of SEM, including the use of channeling patterns to evaluate the crystallographic orientation of micron-sized regions; use of backscattered detectors to reveal grain boundaries on unetched samples and domain boundaries in ferromagnetic alloys; and the use of voltage contrast, electron beam-induced currents, and cathodoluminescence for the characterization and failure analysis of semiconductor devices. The article compares the features of SEM with that of scanning Auger microscopes, and lists the applications and limitations of SEM.