Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Topics
Book Series
Date
Availability
1-3 of 3
Electronic packaging materials
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006554
EISBN: 978-1-62708-290-7
Abstract
This article is a detailed account of the advantages, disadvantages, and applications of microdispensing processes used in electronics manufacturing industries. The discussion covers various approaches to control material flow, namely time pressure, auger, positive displacement, and progressive cavity pump dispensing. The concept of valving to control starting and stopping is also discussed. The applications include printing solders in microelectronic packaging, printing to pads, printing conductive patterns for antennas, printing active circuits, printing on flexible surfaces, and structural printing.
Book Chapter
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003056
EISBN: 978-1-62708-200-6
Abstract
Many applications of ceramics and glasses require them to be joined to each other or to other materials such as metals. This article focuses on ceramic joining technologies, including glass-metal sealing, glass-ceramic/metal joining, ceramic-metal joining, ceramic-ceramic joining, and the more advanced joining of nonoxide ceramics. It also discusses metallizing, brazing, diffusion bonding, and chemical bonding.
Book Chapter
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003065
EISBN: 978-1-62708-200-6
Abstract
The large majority of the commercially important glasses are processed from a carefully calculated batch of raw materials that is then melted in special furnaces. Providing an introduction to melting practices of glass production, this article focuses on various finishing methods of glass products, including forming, grinding and polishing, and explores the advantages, disadvantages and steps involved in sol-gel process. It also discusses the types, processes and properties of annealed, laminated, and tempered glass, and presents the steps involved in glass decoration. The article gives a detailed account of production, properties and application of fiberglass, optical fibers, glass spheres and ceramic glasses, and describes the forms, classification, compositions and properties of glass/metal and glass-ceramic/metal seals.