This article reviews the performance of power electronics components, namely, power rectifiers, insulated-gate bipolar transistors, metal-oxide semiconductor field-effect transistors, diodes, and silicon-controlled rectifiers. It provides information on induction heating power supplies with multiple heat stations, such as switching units and multiple (zone) outputs. The article describes power supply operational control and power supply protection circuits. It details duty cycle, power factor, and harmonics of power supplies. The article also describes system parameters, software analysis-calculations, human analysis-decisions, multiple system arrangements, and zone control systems for power supply selection. It provides information on the maintenance of induction power supplies, detailing the safety precautions to be taken and the need for routine inspection and servicing.

Thermal spray processes involve complete or partial melting of a feedstock material in a high-temperature flame, and propelling and depositing the material as a coating on a substrate. This article describes the properties of sprayed electronic materials, including dielectrics, conductors, and resistors, and discusses their implications and associated limitations for device applications and potential remedial measures. The article presents specific examples of electrical/electronic device applications, including electromagnetic interference/radio-frequency interference shielding, planar microwave devices, waveguide devices, sensing devices, solid oxide fuel cells, heating elements, electrodes for capacitors and other electrochemical devices.

This article describes the fundamental theory of magnetic pulse welding (MPW). It reviews the equipment used for MPW, namely, work coil, capacitor bank, high-voltage power supply, high-voltage switches, and field shapers. The article discusses the MPW process and explains the critical parameters needed to obtain acceptable welds. Applications and safety guidelines of the MPW are also presented.

This article focuses on the various types of corrosion-related failure mechanisms and their effects on passive electrical components. The types include halide-induced corrosion, organic-acid-induced corrosion, electrochemical metal migration, silver tarnish, fretting, and metal whiskers. The passive electrical components include resistors, capacitors, wound components, sensors, transducers, relays, switches, connectors, printed circuit boards, and hardware.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.