This article provides information on single-shot and scanning, the two types of induction heat treating processes that are based on whether the induction coil is moving relative to the part during the heating process. It describes the effect of the frequency of induction heating current on the induction coil and process design, and the control of heating in different areas of the inductor part. The article reviews three main tools for adjustment of coil design and fabrication: coupling gap, coil copper profile, and magnetic flux controllers. It examines the method of holding a part and presenting it to the inductor during the initial inductor design. The article provides information on coil leads/busswork and contacts that mechanically and electrically connect the induction coil head to the power supply. It concludes with a discussion on flux and oxide removal, leak and flow checking, silver plating, and electrical parameter measurement.

Copper can be electrodeposited from numerous electrolytes. Cyanide and pyrophosphate alkalines, along with sulfate and fluoborate acid baths, are the primary electrolytes used in copper plating. This article provides information on the chemical composition, plating baths, and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating. The article also discusses selective plating, electroforming, and other processes and where they are typically used.

Electroplated silver is used in both decorative and functional applications, such as engineering and electrical/electronic applications. This article explains the solution formulations and specifications of electrolytes used in silver plating.