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Copper plating
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Series: ASM Handbook
Volume: 4A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v04a.a0005784
EISBN: 978-1-62708-165-8
Abstract
A wide variety of stop-off technologies for heat treatment are used to selectively prevent the diffusion of carbon and/or nitrogen during atmosphere carburizing, carbonitriding, vacuum carburizing, and various forms of nitriding. In addition to selective stop-off, technologies are also available for scale prevention in open-fired furnaces. This article describes two stop-off technologies, mechanical masking and copper plating, along with stop-off paints/compounds. Prior to the application of stop-off paints, the part surface of the furnaces should be properly cleaned and dried. The article also describes the usage of stop-off paints in different heat treating processes, namely, carburizing and carbonitriding, deep carburizing, vacuum carburizing, nitriding and nitrocarburizing, and plasma nitriding. The article concludes by reviewing the application methods of stop-off paints: brushing, dipping, dispensing, spraying and stamping.
Book Chapter
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003215
EISBN: 978-1-62708-199-3
Abstract
Copper can be electrodeposited from numerous electrolytes. Cyanide and pyrophosphate alkalines, along with sulfate and fluoborate acid baths, are the primary electrolytes used in copper plating. This article provides information on the chemical composition, plating baths, and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating. The article also discusses selective plating, electroforming, and other processes and where they are typically used.
Book Chapter
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003216
EISBN: 978-1-62708-199-3
Abstract
This article describes the steps, bath composition and characteristics, equipment, plating rate, deposit thickness, and applications for different types of nonelectrolytic deposition processes, including electroless nickel plating, electroless copper plating and mechanical plating.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001255
EISBN: 978-1-62708-170-2
Abstract
Copper alloys are widely used as electroplated coatings. They can also be used with practically any substrate material that is suitable for electroplating. This article focuses on the solution composition and operating conditions for brass and bronze plating solutions. It describes the decorative and engineering applications of brass and bronze plating. The article also provides information on the treatment of waste water from brass and bronze plating operations.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001242
EISBN: 978-1-62708-170-2
Abstract
This article provides a detailed account of the various alkaline and acid plating baths used for electrolytic copper plating. Dilute cyanide and Rochelle cyanide baths, high-efficiency sodium and potassium cyanide baths, alkaline noncyanide copper plating baths, and alkaline copper pyrophosphate baths, are discussed. The article reviews acid plating baths such as copper sulfate bath and copper fluoborate bath. It also presents information on the surface preparation considerations, bath composition, and operating variables of copper plating as well as the equipment used.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001265
EISBN: 978-1-62708-170-2
Abstract
Electroless, or autocatalytic, metal plating is a nonelectrolytic method of deposition from solution that can be plated uniformly over all surfaces, regardless of size and shape. The plating's ability to plate onto nonconductors is an advantage that contributes to the choice of electroless copper in various applications. This article provides information on the bath chemistry and deposit properties of electroless copper and discusses the applications of electroless copper plating, such as printed wiring boards, decorative plating-on-plastic, electromagnetic interference shielding, and hybrid and other advanced applications. It describes two commercial processes, pretreatment and post-treatment. The article reviews the solutions used, controls and control equipment, and performance criteria of electroless copper plating. It concludes with information on the environmental and safety issues associated with electroless copper plating.