This article provides a discussion on ten rules for the effective production of reliable castings. These rules include good-quality melt, liquid front damage, liquid front stop, bubble damage, core blows, shrinkage damage, convection damage, segregation, residual stress, and location points.

This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.