There are several main sources of thermophysical property data that provide the most authoritative and comprehensive compilations of critically and systematically evaluated data that are presently available. This article provides thermophysical property data to assist in the materials properties selection for the simulation of casting processes. The measurements of thermophysical property are difficult due to high temperatures and the reactivity of some alloys. The article discusses the strategies adopted to minimize the effects of high temperatures and reactivity of alloys. It presents the thermophysical properties of pure metals and some commercial alloys and tabulates the enthalpy of fusion and solidus and liquidus temperatures for various alloys of commercial interest. The article also lists the density, thermal conductivity, surface tension, and viscosity for some commercial alloys.

Soldering is defined as a joining process by which two substrates are bonded together using a filler metal with a liquidus temperature. This article provides an overview of fundamentals of soldering and presents guidelines for flux selection. Types of fluxes, including rosin-base fluxes, organic fluxes, inorganic fluxes, and synthetically activated fluxes, are reviewed. The article describes the joint design and precleaning and surface preparation for soldering. It addresses some general considerations in the soldering of electronic devices. Soldering process parameters, affecting wetting and spreading phenomena, such as temperature, time, vapor pressure, metallurgical and chemical nature of the surfaces, and surface geometry, are discussed. The article also describes the applications of furnace soldering, resistance soldering, infrared soldering, and ultrasonic soldering. It contains a table that lists tests commonly used to evaluate the solderability properties of selected soldered components.