Skip Nav Destination
September 12–15, 2022
View ASM Events page>
ASM Technical Books
Microelectronics Failure Analysis: Desk Reference (Seventh Edition)
Edited by
ASM International
ISBN electronic:
978-1-62708-247-1
Publication date:
2019
Book Chapter
FIB Overview
-
Published:2019
Abstract
With the commercialization of heavier and lighter ion beams, adoption of focused ion beam (FIB) use for analysis of challenging regions of interest (ROI) has grown. In this chapter, the authors focus on highlighting commercially available and complementary FIB technologies and their implementation challenges and application trends.
You do not currently have access to this chapter.
Sign in
Don't already have an account? Register
You could not be signed in. Please check your email address / username and password and try again.
ASM members
Member Sign InCitation
Chris Park, Amir Avishai, David Pan, Brett Lewis, Alex Buxbaum, FIB Overview, Microelectronics Failure Analysis: Desk Reference, 7th ed., Edited By Tejinder Gandhi, ASM International, 2019, p 335–350, https://doi.org/10.31399/asm.tb.mfadr7.t91110335
Download citation file:
IMAT Registration
September 12–15, 2022
New Orleans, Louisiana
Keep up to date with the latest materials, applications and technologies. Register today for IMAT 2022!
Related Book Content
Gallium and Gallium Compounds
Properties and Selection: Nonferrous Alloys and Special-Purpose Materials
Failure Localization with Active and Passive Voltage Contrast in FIB and SEM
Microelectronics Failure Analysis: Desk Reference (Seventh Edition)
Role of Advanced Circuit Edit for First Silicon Debug
Microelectronics Failure Analysis: Desk Reference (Seventh Edition)
Cross-Sectioning: Mechanical Polishing, Ion Milling, and Focused Ion Beam (FIB)
Microelectronics Failure Analysis: Desk Reference (Seventh Edition)