Microelectronics Failure Analysis: Desk Reference (Seventh Edition)
Non-destructive Techniques for Advanced Board Level Failure Analysis
-
Published:2019
Abstract
In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic...
Sign in
ASM members
Member Sign InChristian Schmidt, Non-destructive Techniques for Advanced Board Level Failure Analysis, Microelectronics Failure Analysis: Desk Reference, 7th ed., Edited By Tejinder Gandhi, ASM International, 2019, p 25–31, https://doi.org/10.31399/asm.tb.mfadr7.t91110025
Download citation file:
IMAT Registration
September 12–15, 2022
New Orleans, Louisiana
Keep up to date with the latest materials, applications and technologies. Register today for IMAT 2022!