Ion nitriding equipment can be categorized into two groups: cold-wall continuous direct current (dc) equipment and hot-wall pulsed dc equipment. This chapter focuses on these two categories along with other important considerations for ion (plasma) nitriding equipment and processing. Other important considerations discussed include the hollow cathode effect, sputter cleaning, furnace loading, pressure/voltage relationships, workpiece masking, and furnace configuration options. The chapter describes five methods of cooling parts from the process temperature to an acceptable exposure temperature after plasma nitriding. The chapter also presents some of the advantages of the pulsed plasma process.