Printed Circuit Board Failures at Plated Through Holes
An open electrical circuit was found between plated through-holes in a six-layer printed circuit board after thermal cycling. The copper plating was very thin in the failure area but did make an electrical contact during initial testing. During thermal cycling, differential z-expansion between the epoxy board and copper caused the thin plating to crack. During electrical testing of a four-layer circuit board, an open electrical circuit was found between the plated through-holes. Plating discontinuity was caused by poor drilling using a dull drill with improper speed (rpm) and/or feed rate as was observed by nonuniform plating and nodule formation...
Printed Circuit Board Failures at Plated Through Holes, ASM Failure Analysis Case Histories: Processing Errors and Defects, ASM International, 2019, https://doi.org/10.31399/asm.fach.process.c9001493
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