Skip to Main Content
Skip Nav Destination

An open electrical circuit was found between plated through-holes in a six-layer printed circuit board after thermal cycling. The copper plating was very thin in the failure area but did make an electrical contact during initial testing. During thermal cycling, differential z-expansion between the epoxy board and copper caused the thin plating to crack. During electrical testing of a four-layer circuit board, an open electrical circuit was found between the plated through-holes. Plating discontinuity was caused by poor drilling using a dull drill with improper speed (rpm) and/or feed rate as was observed by nonuniform plating and nodule formation...

You do not currently have access to this chapter.
Don't already have an account? Register
Close Modal

or Create an Account

Close Modal
Close Modal