Welding, Brazing, and Soldering
Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using examples of both structural and electronic applications. The article concludes with a discussion on the environmental, safety, and health issues to be considered during soldering.
Paul T. Vianco, General Soldering, Welding, Brazing, and Soldering, Vol 6, ASM Handbook, Edited By David LeRoy Olson, Thomas A. Siewert, Stephen Liu, Glen R. Edwards, ASM International, 1993, p 964–984, https://doi.org/10.31399/asm.hb.v06.a0001459
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New Handbook: Volume 11B
Now available in the Digital Library! Volume 11B serves as a reference and guide to help engineers determine the causes of failure in plastic components and make corrective adjustments through design and manufacturing modifications.