Welding, Brazing, and Soldering
Furnace and Infrared Soldering
Furnace soldering (FS) encompasses a group of reflow soldering techniques in which the parts to be joined and preplaced filler metal are put in a furnace and then heated to the soldering temperature. This article describes three reflow soldering techniques in surface-mount technology, namely, vapor-phase reflow, area conduction, and infrared heating. These three techniques are considered as mass reflow techniques, because all of the solderable interconnections on the surface of a printed wiring board (PWB) assembly are brought through the reflow heating cycle simultaneously. The article explains four regions of reflow profile, namely, preheat (prebake), preflow (soak), reflow, and cooldown. It concludes with a description on the bare copper assembly process, which is carried out in the inert atmosphere.
Phil Zarrow, Furnace and Infrared Soldering, Welding, Brazing, and Soldering, Vol 6, ASM Handbook, Edited By David LeRoy Olson, Thomas A. Siewert, Stephen Liu, Glen R. Edwards, ASM International, 1993, p 353–355, https://doi.org/10.31399/asm.hb.v06.a0001395
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New Handbook: Volume 11B
Now available in the Digital Library! Volume 11B serves as a reference and guide to help engineers determine the causes of failure in plastic components and make corrective adjustments through design and manufacturing modifications.