Wave Soldering
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Published:1993
Abstract
This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information on process parameters, which can be divided into three groups: the fluxing operation, solder wave properties, and process schedule. It provides information on various solder defects.
Paul T. Vianco, Wave Soldering, Welding, Brazing, and Soldering, Vol 6, ASM Handbook, Edited By David LeRoy Olson, Thomas A. Siewert, Stephen Liu, Glen R. Edwards, ASM International, 1993, p 366–368, https://doi.org/10.31399/asm.hb.v06.a0001401
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