Fatigue of Solders and Electronic Materials
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Published:1996
Abstract
This article focuses on the isothermal fatigue of solder materials. It discusses the effect of strain range, frequency, hold time, temperature, and environment on isothermal fatigue life. The article provides information on various isothermal fatigue testing methods used to assess solder joint reliability. These include the accelerated thermal cycling test and isothermal mechanical deflection system test.
Aleksander Zubelewicz, Semyon Vaynman, Srinivas T. Rao, Fatigue of Solders and Electronic Materials, Fatigue and Fracture, Vol 19, ASM Handbook, By ASM Handbook Committee, ASM International, 1996, p 882–891, https://doi.org/10.31399/asm.hb.v19.a0002413
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