Failure Analysis and Prevention
X-Ray Diffraction Residual Stress Measurement in Failure Analysis
This article focuses primarily on what an analyst should know about applying X-ray diffraction (XRD) residual stress measurement techniques to failure analysis. Discussions are extended to the description of ways in which XRD can be applied to the characterization of residual stresses in a component or assembly. The article describes the steps required to calibrate instrumentation and to validate stress measurement results. It presents a practical approach to sample selection and specimen preparation, measurement location selection, and measurement depth selection, as well as an outline on measurement validation. The article also provides information on stress-corrosion cracking and corrosion fatigue....
J.A. Pineault, M. Belassel, M.E. Brauss, X-Ray Diffraction Residual Stress Measurement in Failure Analysis, Failure Analysis and Prevention, Vol 11, Edited By William T. Becker, Roch J. Shipley, ASM International, 2002, p 484–497, https://doi.org/10.31399/asm.hb.v11.a0003528
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