Corrosion in Semiconductor Wafer Fabrication
-
Published:2006
Abstract
This article presents a detailed examination of corrosion at the various production stages of wafer fabrication. The corrosion issues related to batch metal-etch systems and single-wafer metal-etch systems are also discussed. The article provides a case study, which illustrates that the factors outside the normal processing of wafers or tool-specific problems can contribute to metal-line corrosion.
Mercy Thomas, Gary Hanvy, Khuzema Sulemanji, Corrosion in Semiconductor Wafer Fabrication, Corrosion: Environments and Industries, Vol 13C, ASM Handbook, Edited By Stephen D. Cramer, Bernard S. Covino, Jr., ASM International, 2006, p 623–628, https://doi.org/10.31399/asm.hb.v13c.a0004171
Download citation file:
2024 Catalog
View new, upcoming, and best-selling ASM Handbooks, technical books, and databases.
