Plasma-Enhanced Chemical Vapor Deposition
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Published:1994
Abstract
This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.
Prabha K. Tedrow, Rafael Reif, Plasma-Enhanced Chemical Vapor Deposition, Surface Engineering, Vol 5, ASM Handbook, Edited By C.M. Cotell, J.A. Sprague, F.A. Smidt, Jr., ASM International, 1994, p 532–537, https://doi.org/10.31399/asm.hb.v05.a0001285
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