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ASM Handbook
Surface Engineering
Edited by
ASM International
Volume
5
ISBN electronic:
978-1-62708-170-2
Publication date:
1994
Book Chapter
Chemical Vapor Deposition of Nonsemiconductor Materials
-
Published:1994
Page range:
510 - 516
Abstract
This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD reactions of materials related to hard, tribological, and high-temperature coatings and to free-standing structures. It concludes by reviewing the advantages, disadvantages, and applications of CVD.
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Citation
Hugh O. Pierson, Chemical Vapor Deposition of Nonsemiconductor Materials, Surface Engineering, Vol 5, ASM Handbook, Edited By C.M. Cotell, J.A. Sprague, F.A. Smidt, Jr., ASM International, 1994, p 510–516, https://doi.org/10.31399/asm.hb.v05.a0001283
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