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Abstract

X-ray diffraction residual stress measurements are one of industry’s most versatile materials characterization tools. The procedure involves placing a known strain on a test sample and calculating the residual stress that would be required produce it, assuming a linear elastic distortion of the crystal lattice. This article describes the two most common x-ray diffraction measurement techniques based on the plane stress elastic model. It explains the difference between single and two-angle diffraction methods, and identifies potential sources of measurement error for each. The article also presents several application examples.

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Paul S. Prevey, 1986. "X-Ray Diffraction Residual Stress Techniques", Materials Characterization, Ruth E. Whan

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