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Abstract

This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information on process parameters, which can be divided into three groups: the fluxing operation, solder wave properties, and process schedule. It provides information on various solder defects.

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Paul T. Vianco, 1993. "Wave Soldering", Welding, Brazing and Soldering, David LeRoy Olson, Thomas A. Siewert, Stephen Liu, Glen R. Edwards

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