Welding, Brazing and Soldering
This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information on process parameters, which can be divided into three groups: the fluxing operation, solder wave properties, and process schedule. It provides information on various solder defects.
ASM Reference Publications Catalog
The Fall / Winter 2019-2020 Catalog features more than 200 products including new and upcoming releases, popular best sellers, digital databases, and journals. Save now with set sales.