Skip to Main Content


Hot gas soldering is a process that is commonly used in applications where the workpiece thermal mass is small and the melting temperature of the solder is relatively low. This article describes the characteristics of hot gas heating that are critical to its effectiveness in soldering. These characteristics include the focus of gas flow, gas flow rates (velocity and volume), gas temperature, and typical gas media. The article explains the thermal profile of a component being soldered and the temperature across adjacent components, which helps to understand time-temperature relationship. It concludes with a discussion on reliability concerns and processing concerns when using hot gas soldering in electronics assembly.

You do not currently have access to this chapter.
Don't already have an account? Register

Michael D. Frederickson, Hot Gas Soldering, Welding, Brazing and Soldering, Vol 6, ASM Handbook, Edited By David LeRoy Olson, Thomas A. Siewert, Stephen Liu, Glen R. Edwards, ASM International, 1993, p 361–362,

Download citation file:

Close Modal
This Feature Is Available To Subscribers Only

Sign In or Create an Account

Close Modal
Close Modal