Fatigue of Solders and Electronic Materials
This article focuses on the isothermal fatigue of solder materials. It discusses the effect of strain range, frequency, hold time, temperature, and environment on isothermal fatigue life. The article provides information on various isothermal fatigue testing methods used to assess solder joint reliability. These include the accelerated thermal cycling test and isothermal mechanical deflection system test.
ASM Reference Publications Catalog
The Fall / Winter 2019-2020 Catalog features more than 200 products including new and upcoming releases, popular best sellers, digital databases, and journals. Save now with set sales.