Skip to Main Content

Abstract

This article presents a detailed examination of corrosion at the various production stages of wafer fabrication. The corrosion issues related to batch metal-etch systems and single-wafer metal-etch systems are also discussed. The article provides a case study, which illustrates that the factors outside the normal processing of wafers or tool-specific problems can contribute to metal-line corrosion.

You do not currently have access to this chapter.
Don't already have an account? Register

Mercy Thomas, Gary Hanvy, Khuzema Sulemanji, 2006. "Corrosion in Semiconductor Wafer Fabrication", Corrosion: Environments and Industries, Stephen D. Cramer, Bernard S. Covino, Jr.

Download citation file:


Close
Close Modal
This Feature Is Available To Subscribers Only

Sign In or Create an Account

Close Modal
Close Modal