Skip to Main Content

Abstract

This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.

Abstract

This article presents a detailed examination of corrosion at the various production stages of wafer fabrication. The corrosion issues related to batch metal-etch systems and single-wafer metal-etch systems are also discussed. The article provides a case study, which illustrates that the factors outside the normal processing of wafers or tool-specific problems can contribute to metal-line corrosion.

You do not currently have access to this chapter.
Don't already have an account? Register

2006. "Corrosion in the Microelectronics Industry", Corrosion: Environments and Industries, Stephen D. Cramer, Bernard S. Covino, Jr.

Download citation file:


Close
Close Modal
This Feature Is Available To Subscribers Only

Sign In or Create an Account

Close Modal
Close Modal