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Abstract

This article presents a detailed examination of corrosion at the various production stages of wafer fabrication. The corrosion issues related to batch metal-etch systems and single-wafer metal-etch systems are also discussed. The article provides a case study, which illustrates that the factors outside the normal processing of wafers or tool-specific problems can contribute to metal-line corrosion.

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Mercy Thomas, Gary Hanvy, Khuzema Sulemanji, Corrosion in Semiconductor Wafer Fabrication, Corrosion: Environments and Industries, Vol 13C, ASM Handbook, Edited By Stephen D. Cramer, Bernard S. Covino, Jr., ASM International, 2006, p 623–628, https://doi.org/10.31399/asm.hb.v13c.a0004171

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