Corrosion: Environments and Industries
This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.
ASM Reference Publications Catalog
The new Fall / Winter 2019-2020 Catalog features more than 200 new and upcoming releases and our popular best-selling titles. Save now with prepublication pricing and set sales.