Skip to Main Content

Abstract

This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD reactions of materials related to hard, tribological, and high-temperature coatings and to free-standing structures. It concludes by reviewing the advantages, disadvantages, and applications of CVD.

You do not currently have access to this chapter.
Don't already have an account? Register

Hugh O. Pierson, 1994. "Chemical Vapor Deposition of Nonsemiconductor Materials", Surface Engineering, C.M. Cotell, J.A. Sprague, F.A. Smidt, Jr.

Download citation file:


Close
Close Modal
This Feature Is Available To Subscribers Only

Sign In or Create an Account

Close Modal
Close Modal