Skip to Main Content

Abstract

This article provides a detailed account of the various alkaline and acid plating baths used for electrolytic copper plating. Dilute cyanide and Rochelle cyanide baths, high-efficiency sodium and potassium cyanide baths, alkaline noncyanide copper plating baths, and alkaline copper pyrophosphate baths, are discussed. The article reviews acid plating baths such as copper sulfate bath and copper fluoborate bath. It also presents information on the surface preparation considerations, bath composition, and operating variables of copper plating as well as the equipment used.

You do not currently have access to this chapter.
Don't already have an account? Register

L.M. Weisenberger, B.J. Durkin, 1994. "Copper Plating", Surface Engineering, C.M. Cotell, J.A. Sprague, F.A. Smidt, Jr.

Download citation file:


Close
Close Modal
This Feature Is Available To Subscribers Only

Sign In or Create an Account

Close Modal
Close Modal