This article focuses on the electroless gold plating technique, describing the advantages and limitations, applications, and properties of plated deposits. It also reviews process variables of the technique, including gold concentration, reducing agent, agitation, and contaminants.
Jean W. Chevalier, Electroless Gold Plating, Surface Engineering, Vol 5, ASM Handbook, Edited By C.M. Cotell, J.A. Sprague, F.A. Smidt, Jr., ASM International, 1994, p 323–325, https://doi.org/10.31399/asm.hb.v05.a0001266
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