Skip to Main Content

Abstract

This article is a detailed account of the advantages, disadvantages, and applications of microdispensing processes used in electronics manufacturing industries. The discussion covers various approaches to control material flow, namely time pressure, auger, positive displacement, and progressive cavity pump dispensing. The concept of valving to control starting and stopping is also discussed. The applications include printing solders in microelectronic packaging, printing to pads, printing conductive patterns for antennas, printing active circuits, printing on flexible surfaces, and structural printing.

You do not currently have access to this chapter.
Don't already have an account? Register

Kenneth Church, Microdispensing Processes, Additive Manufacturing Processes, Vol 24, ASM Handbook, Edited By David L. Bourell, William Frazier, Howard Kuhn, Mohsen Seifi, ASM International, 2020, p 431–436, https://doi.org/10.31399/asm.hb.v24.a0006554

Download citation file:


Close
Close Modal

or Create an Account

Close Modal
Close Modal