Search Results for thermogravimetric analysis

Fig. 8 Thermogravimetric analysis thermogram showing the weight-loss profile for a typical plastic resin More

Fig. 9 Thermogravimetric analysis thermogram representing a typical semicrystalline plastic resin More

Fig. 10 Thermogravimetric analysis thermogram representing a typical amorphous plastic resin More

Fig. 11 Thermogravimetric analysis thermogram showing a high level of residual stress in an amorphous plastic resin More

Fig. 37 Thermogravimetric analysis weight-loss profile comparison showing a reduction in the thermal stability of the discolored surface material relative to the base material More

Fig. 22 Thermogravimetric analysis thermogram from rubber strands of failed bungee cord sample indicating ~20% rubber and ~80% filler More

Fig. 23 Thermogravimetric analysis thermogram from rubber strands of competitors’ bungee cord sample indicating ~80% rubber and ~20% filler More

Fig. 4 Thermogravimetric analysis weight-loss profile comparison showing a reduction in the thermal stability of the discolored surface material relative to the base material More

Fig. 33 Relative thermal stability of polymers by thermogravimetric analysis (TGA); 10 mg (0.15 gr) at 5 °C/min (9 °F/min), in nitrogen. HDPE, high-density polyethylene; PMMA, polymethyl methacrylate; PTFE, polytetrafluoroethylene; PVC, polyvinyl chloride More

Fig. 34 Thermogravimetric analysis (TGA) of silica- and carbon-filled polytetrafluoroethylene (PTFE); 10 mg (0.15 gr) at 5 °C/min (9 °F/min). Source: Ref 25 More

Fig. 35 Thermogravimetric analysis (TGA) of polyvinyl chloride (PVC), 21.41 mg (0.33 gr), 20 °C/min (36 °F/min) to 950 °C (1740 °F), in nitrogen More

Fig. 36 Thermogravimetric analysis-Fourier transform infrared spectroscopy (TGA-FTIR) of polyvinyl chloride (PVC) More

Fig. 11 Typical thermogravimetric analysis curve for fiberglass-vinyl ester prepregs More

Fig. 12 Thermogravimetric analysis of encapsulating materials, 20 to 30 mg (0.3 to 0.5 gr), 10 °C/min (18 °F/min), air at 40 mL/min. Courtesy of Motorola Semiconductor Products Division More

Fig. 13 Relative thermal stability of polymers by thermogravimetric analysis; 10 mg (0.15 gr) at 5 °C/min (9 °F/min) in nitrogen. PVC, polyvinyl chloride; PMMA, polymethylmethacrylate; HDPE, high-density polyethylene; PTFE, polytetrafluoroethylene; PI, polyimide More

Fig. 14 Thermogravimetric analysis of silica and carbon-filled polytetrafluoroethylene (PTFE); 10 mg (0.15 gr) at 5 °C/min (9 °F/min). Source: Ref 53 More

Fig. 15 Thermogravimetric analysis tracing of postcured Ethacure 300/6-FDA (hexafluoropropane dianhydride) at 10 °C/min (18 °F/min) in nitrogen More

Fig. 16 Thermogravimetric analysis tracing of postcured Ethacure 300/PMDA (pyromellitic dianhydride) at 10 °C/min (18 °F/min) in nitrogen More

Fig. 28 Thermogravimetric analysis of reinforced nylon; 40 °C/min (70 °F/min) in air More

Fig. 29 Thermogravimetric analysis of reinforced nylon; 80 °C/min (1450 °F/min) in air More