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Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006771
EISBN: 978-1-62708-295-2
... Electrons Ions Average sampling depth 5 nm 5 nm 2 nm Typical detection limits 10 −3 10 −3 10 −6 Spatial resolution 0.005 μm 5–10 μm 0.05 μm Information Elemental, some chemical secondary-electron microscopyphotos Elemental, chemical Elemental, molecular Strengths Ultimate...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003534
EISBN: 978-1-62708-180-1
... Probe beam Electrons X-ray photons Ions Analyzed beam Electrons Electrons Ions Average sampling depth 5 nm 5 nm 2 nm Detection limits 10 −3 10 −4 10 −6 Spatial resolution 10 nm 5–10 μm 150 nm Information Mostly elemental, SEM photos Elemental, chemical Elemental...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.process.c0045926
EISBN: 978-1-62708-235-8
... include AES, XPS, SIMS, and LAMMA. These techniques vary greatly in spatial resolution, sensitivity, speed, and the type of information obtained, but all surface-analysis techniques are similar in that the information is obtained from a very thin surface layer. Because many adhesion problems are related...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.process.c0045918
EISBN: 978-1-62708-235-8
... that is crucial to understanding the failure cause and sequence. Auger analysis has proved to be the most useful in this regard because it can detect thin-film residues, which may include traces of the stress-corrosion environment, and because it has high spatial resolution for documenting the fractographic...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006764
EISBN: 978-1-62708-295-2
... input, and high-resolution instrument. IR systems are sensitive to surface emissivity. Rapid examination of large areas. Can be adapted to production inspections Circuit board solder joints, solar cells, heat-transfer equipment, metals, composites, concrete Sonic IR/vibro-thermography, inductive IR...
Series: ASM Handbook
Volume: 11B
Publisher: ASM International
Published: 15 May 2022
DOI: 10.31399/asm.hb.v11B.a0006943
EISBN: 978-1-62708-395-9
... features on a polymer surface Feature Optical Electron Probe Invention year 1590 1931 1983 Resolution:     XY 1000 nm 10 nm 1 nm     Z … … 0.01 nm Operating environment Air, liquid, vacuum Vacuum Air, liquid, vacuum Approximate cost >$100 >$50,000...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006769
EISBN: 978-1-62708-295-2
... on the emitted electrons, causing them to be focused at a point near the exit hole of the filament/Wehnelt gun assembly. The size of this focused crossover point is one factor in determining the ultimate spatial resolution of the instrument. Field-emission SEMs have a different system of electron emission...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003533
EISBN: 978-1-62708-180-1
.... The size of this focused crossover point is one factor in determining the ultimate spatial resolution of the instrument. Field emission SEMs have a smaller crossover point, which is the reason for their higher resolving capabilities. Once the focused electron beam passes the anode, it enters the first...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003527
EISBN: 978-1-62708-180-1
... present on the fracture surfaces of failed components. To the extent possible, confusing backgrounds should be eliminated through the use of background paper or material. Stereophotography is extremely useful at this stage of the failure analysis process to record component configuration and spatial...
Series: ASM Handbook
Volume: 11B
Publisher: ASM International
Published: 15 May 2022
DOI: 10.31399/asm.hb.v11B.a0006851
EISBN: 978-1-62708-395-9
... dynamic range image processing Fig. 28 Computer-controlled digital microscopic high-resolution Z-stack image of exemplar crankshaft fracture with light-emitting diode ring light illumination Fig. 29 Computer-controlled digital microscopic optical-SEM Z-stack image of exemplar...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.steel.c9001535
EISBN: 978-1-62708-232-7
... martensite matrix. The apparent sizes of these fine globular carbides (as can be judged from the micron marker) is much lower than 1 µm (lower than the spatial resolution limit of the EPMA) and are hence not amenable to electron-probe microanalysis. The backscattered electron (BSE) image of the same field...
Series: ASM Handbook
Volume: 11B
Publisher: ASM International
Published: 15 May 2022
DOI: 10.31399/asm.hb.v11B.a0006936
EISBN: 978-1-62708-395-9
... of image quality and possible loss of data. Digital systems enable the inspector to select the distance between points when scanning and indexing the transducer. These parameters define the spatial resolution of the image, provided the aforementioned issues with scanner stiffness, backlash, and lost data...
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006838
EISBN: 978-1-62708-329-4
... in the visible wavelength range (380 to 700 nm) or by light emitted at infrared wavelengths. Powder-bed and component monitoring involves a very large amount of data. For a typical build area of 250 by 250 mm (10 by 10 in.) and a spatial resolution of 10 μm, a full layer monitor must have an image resolution...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006768
EISBN: 978-1-62708-295-2
... ( Ref 13 ). The importance of the XRD method resides in its ability to measure residual and applied stress with high spatial resolution, speed, and excellent accuracy, and, in many cases, measurements can be performed nondestructively ( Ref 14 ). The measurement of residual stress via XRD is generally...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003528
EISBN: 978-1-62708-180-1
... been made in detector speed and resolution ( Ref 10 , 11 ), data analysis and handling (due primarily to the advent of the personal computer), and equipment portability ( Ref 12 ). The importance of the XRD method resides in its ability to measure residual and applied stress with high spatial...
Series: ASM Handbook
Volume: 11B
Publisher: ASM International
Published: 15 May 2022
DOI: 10.31399/asm.hb.v11B.9781627083959
EISBN: 978-1-62708-395-9
Book Chapter

Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003541
EISBN: 978-1-62708-180-1
... the same structure as natural rubber but lacks the impurities. The physical state of a polymer under a given condition is primarily governed by chain flexibility, which in turn is determined by its backbone and the size and shape of the side groups and their spatial organization. Polymers can act...
Series: ASM Handbook
Volume: 11B
Publisher: ASM International
Published: 15 May 2022
DOI: 10.31399/asm.hb.v11B.a0006865
EISBN: 978-1-62708-395-9
... of polymer fracture are a subject of continuing research, practical fracture analysis is achievable from examining deformation events within the resolution of optical and scanning electron microscopy (SEM). Irreversible deformation mechanisms in polymers may fall into two basic categories: dilatational...
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006807
EISBN: 978-1-62708-329-4
... at constant strain. When a material is constrained to deform under creep, creep damage occurs locally by the transformation of elastic strain into permanent plastic strain by creep deformation. This, in turn, results in a reduction of the applied stress over time ( Ref 31 ). In addition, the spatial position...