1-20 of 73 Search Results for

soldering

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
... Abstract Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.chem.c9001441
EISBN: 978-1-62708-220-4
... Abstract Soft-soldered copper pipe joints used in refrigerating plants failed. The solder had not adhered uniformly to the pipe surface. In addition, there were some longitudinal grooves on the pipe surfaces, parts of which were not filled with solder. The unsoldered areas formed cavities...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.process.c9001440
EISBN: 978-1-62708-235-8
... Abstract A portable propane container with a name-plate soldered onto it exploded in service. When the vessel was inspected afterwards, it was found to have developed a crack in the top end plate. A portion of the end plate cut out to include the midlength and one termination of the crack...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.steel.c9001234
EISBN: 978-1-62708-232-7
... Abstract In a copper hot water system, a bent pipe was soldered into a straight pipe with twice the diameter. The neighborhood of the soldered joint was covered with corrosion product predominantly blue-green in color, presumably carbonates. When these corrosion products were scratched off...
Image
Published: 01 June 2019
Fig. 3 Intergranular penetration by molten solder. (× 250). More
Image
Published: 01 June 2019
Fig. 1 Failure adjacent to soldered clip × 2 More
Image
Published: 01 December 1992
Fig. 3 SEM micrographs of the solder surface in the demo unit. Note the melted and resolidified crystalline structure in (a). (a) 1000×. (b) 100×. More
Series: ASM Failure Analysis Case Histories
Volume: 1
Publisher: ASM International
Published: 01 December 1992
DOI: 10.31399/asm.fach.v01.c9001132
EISBN: 978-1-62708-214-3
... Fig. 1 As-received components of the demo and failed units. Fig. 2 Separated copper cups of the demo and failed units. Fig. 3 SEM micrographs of the solder surface in the demo unit. Note the melted and resolidified crystalline structure in (a). (a) 1000×. (b) 100...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.modes.c9001674
EISBN: 978-1-62708-234-1
... Abstract Accelerated aging tests on detonator assemblies, to verify the compatibility of gold bridgewire and Pd-In-Sn solder with the intended explosives, revealed an unusual form of corrosion. The tests, conducted at 74 deg C (165 deg F) and 54 deg C (130 deg F), indicated a preferential...
Series: ASM Failure Analysis Case Histories
Volume: 2
Publisher: ASM International
Published: 01 December 1993
DOI: 10.31399/asm.fach.v02.c9001391
EISBN: 978-1-62708-215-0
...) and Group 2 resistors. The group 2 resistor had been exposed to the heat of soldering for 90 s. Note the dark appearance of the top polymer coating. This is due to the pyrolysis, or breakdown, of the epoxy coating. 19.25× Fig. 3 Delaminated group 8 resistor that exhibited a low pushoff strength...
Series: ASM Failure Analysis Case Histories
Volume: 3
Publisher: ASM International
Published: 01 December 2019
DOI: 10.31399/asm.fach.v03.c9001843
EISBN: 978-1-62708-241-9
.... Corros. 59 ( 3 ), 254 – 260 ( 2008 ) 10.1002/maco.200804151 2. Lasky R.C. : Tin pest: a forgotten issue in lead free soldering . In: 2004 SMTA International Conference Proceedings , Chicago, IL , Sept 26–30, 2004 , pp. 838 – 840 3. ROHS Directive—Directive 2002 / 95 / EC...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.process.c9001397
EISBN: 978-1-62708-235-8
... during the soldering operation. Banding Chlorides Electric motors Motor rotors Soldering fluxes Wire 18-8 Stress-corrosion cracking The banding wires of the rotor of an 1800 H.P. motor were renewed following replacement of the banding rings and, after about six months' service...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.bldgs.c9001180
EISBN: 978-1-62708-219-8
... with oxygen to form phosphorus pentoxide. Hard soldering in turn prevented the formation of cuprous oxide, and hydrogen embrittlement occurred. Hot water heating Piping Phosphorus-deoxidized copper Transgranular fracture Stress-corrosion cracking The site of the damage in the T-piece from...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.process.c9001194
EISBN: 978-1-62708-235-8
... the influence of tensile stresses that arose during bending. This phenomenon is known as “solder brittleness.” Bending Boiler tubes Brittleness Overheating 15Mo 3 Metalworking-related failures A seamless hot-drawn boiler tube NW 300 of 318 mm O. D. and 9 mm wall thickness made of steel 15 Mo 3...
Image
Published: 01 June 2019
Fig. 5 Increasing magnification SEM photomicrographs showing the corroded apperance of the Au wire and absence of solder attack on a red plastic header. More
Image
Published: 01 December 1993
Fig. 10 Consistent gross delamination in the group 3 samples, those that had been soldered to the carrier plate. Measurable separation was noted at the metallization interface. 124× More
Image
Published: 01 December 1993
Fig. 3 Delaminated group 8 resistor that exhibited a low pushoff strength. Note the puckered appearance of the gold polymer coating at the left termination. This was caused by the heat of soldering exceeding the T g of the epoxy. 21.6× More
Image
Published: 01 December 1993
Fig. 2 Group 1 (left) and Group 2 resistors. The group 2 resistor had been exposed to the heat of soldering for 90 s. Note the dark appearance of the top polymer coating. This is due to the pyrolysis, or breakdown, of the epoxy coating. 19.25× More
Image
Published: 01 December 1993
Fig. 9 Delaminated termination on a group 6 sample, showing Valox (the pellet encapsulant) intruding on the cermet/polymer thick-film metallization interface. Metallization forced the expansion of the termination, rupturing the nickel barrier and giving the solder joint a cracked appearance More
Image
Published: 01 June 2019
Fig. 6 Corrosion product build-up on a blue plastic header (a), degraded plastic and corroded Au bridgewire (b) after two years at 74 C. The corrosion produce on the solder is Au + In (OH) 2 Cl (c). The corroded bridgewire is shown in a stereo pair at the lower right (d). More