Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).

A portable propane container with a name-plate soldered onto it exploded in service. When the vessel was inspected afterwards, it was found to have developed a crack in the top end plate. A portion of the end plate cut out to include the midlength and one termination of the crack was examined microscopically. This revealed that the crack was associated with intergranular penetration by molten metal. The microstructure in general was indicative of a good-quality mild steel. It was evident from that solder that was responsible for the penetration and that fused brass from the hand wheel had not played any part. Tensile stress was present at the time of the failure sufficiently high to enable solder penetration to take place. The use of soft solder as a medium for attaching name-plates directly on to stressed steel parts is not recommended. It would be preferable to use a welded-on patch plate or to employ one of the high-strength, non-metallic adhesives.

Soft-soldered copper pipe joints used in refrigerating plants failed. The solder had not adhered uniformly to the pipe surface. In addition, there were some longitudinal grooves on the pipe surfaces, parts of which were not filled with solder. The unsoldered areas formed cavities within the joints, some of which had been in direct communication with the outsides via the grooves or interconnected cavities. On cooling, moisture condensed on the external surfaces. Some of this was drawn by capillary action into the cavities in open communication with the external surface. On continued cooling to below freezing-point, water that entered the cavities solidified. This was accompanied by a slight increase in volume, which collapsed the pipe walls. In the examples, the pipe ends had not been properly tinned. The solder used was found to be of the tin-antimony type, containing about 5% antimony, which is more difficult to use than the usual tin-lead alloys. The use of this particular type of solder was a contributory factor in the production of unsound joints in the samples examined.