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Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006771
EISBN: 978-1-62708-295-2
... small area analysis, imaging Ease of use, quantification Chemical and molecular analysis, imaging Limitations Insulator analysis challenging, damaging to organics Very few Quantification difficult Major applications Semiconductors, electronics, metallurgy All industries Polymers...
Abstract
This article covers the three most popular techniques used to characterize the very outermost layers of solid surfaces: Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and time-of-flight secondary ion mass spectrometry (TOF-SIMS). Some of the more important attributes are listed for preliminary insight into the strengths and limitations of these techniques for chemical characterization of surfaces. The article describes the basic theory behind each of the different techniques, the types of data produced from each, and some typical applications. Also discussed are the different types of samples that can be analyzed and the special sample-handling procedures that must be implemented when preparing to do failure analysis using these surface-sensitive techniques. Data obtained from different material defects are presented for each of the techniques. The examples presented highlight the typical data sets and strengths of each technique.
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003534
EISBN: 978-1-62708-180-1
..., molecular Strengths Ultimate small area analysis, imaging Ease of use, quantification Chemical and molecular analysis, imaging Limitations Semiconductive Very few Quantification difficult Major applications Semiconductors, electronics All industries Polymers, contamination, trace metal...
Abstract
This article provides information on the chemical characterization of surfaces by Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and time-of-flight secondary ion mass spectrometry (TOF-SIMS). It describes the basic theory behind each of these techniques, the types of data produced from each, and some typical applications. The article explains the strengths of AES, XPS, and TOF-SIMS based on data obtained from the surface of a slightly corroded stainless steel sheet.
Series: ASM Failure Analysis Case Histories
Volume: 3
Publisher: ASM International
Published: 01 December 2019
DOI: 10.31399/asm.fach.v03.c9001843
EISBN: 978-1-62708-241-9
... structure and is a semiconductor White (beta) tin—body centered tetragonal structure and in the form of metallic tin. Rhombic (gamma) tin—also metallic. Lead Mercury Cadmium Hexavalent chromium (Cr 6+ ) Polybrominated biphenyls (PBB) Polybrominated diphenyl ether (PBDE...
Abstract
The operator of an electric transit system purchased a large number of tin-plated copper connectors, putting some in service and others in reserve. Later, when some of the reserve connectors were inspected, the metal surfaces were covered with spots consisting of an ash-like powder and the plating material had separated from the substrate in many areas. Several connectors, including some that had been in service, were examined to determine what caused the change. The order stated that the connectors were to be coated with a layer of tin-bismuth (2% Bi) to guard against tin pest, a type of degradation that occurs at low temperatures. Based on the results of the investigation, which included SEM/EDS analysis, inductively coupled plasma spectroscopy, and x-ray diffraction, the metal surfaces contained less than 0.1% Bi and thus were not adequately protected against tin pest, which was confirmed as the failure mechanism in the investigation.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006766
EISBN: 978-1-62708-295-2
... constituents in metal alloys. Optical emission spectroscopy is also used for a variety of other analyses, including: Fast elemental depth profiling of technical coatings Determination of trace impurity concentrations in semiconductor materials Wear metals analysis in oils and lubricants Rapid...
Abstract
Identification of alloys using quantitative chemical analysis is an essential step during a metallurgical failure analysis process. There are several methods available for quantitative analysis of metal alloys, and the analyst should carefully approach selection of the method used. The choice of appropriate analytical techniques is determined by the specific chemical information required, the condition of the sample, and any limitations imposed by interested parties. This article discusses some of the commonly used quantitative chemical analysis techniques for metals. The discussion covers the operating principles, applications, advantages, and disadvantages of optical emission spectroscopy (OES), inductively coupled plasma optical emission spectroscopy (ICP-OES), X-ray spectroscopy, and ion chromatography (IC). In addition, information on combustion analysis and inert gas fusion analysis is provided.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006770
EISBN: 978-1-62708-295-2
... to the energy of the incoming x-ray. Placing a voltage across the chip makes it function as an intrinsic semiconductor, and the electrons move to one side of the chip while the holes move to the opposite side, producing a charge pulse from the device. Because the charge pulse is proportional to the number...
Abstract
X-ray spectroscopy is generally accepted as the most useful ancillary technique that can be added to any scanning electron microscope (SEM), even to the point of being considered a necessity by most operators. While “stand-alone” x-ray detection systems are used less frequently in failure analysis than the more exact instrumentation employed in SEMs, the technology is advancing and is worthy of note due to its capability for nondestructive analysis and application in the field. This article begins with information on the basis of the x-ray signal. This is followed by information on the operating principles and applications of detectors for x-ray spectroscopy, namely energy-dispersive spectrometers, wavelength-dispersive spectrometers, and handheld x-ray fluorescence systems. The processes involved in x-ray analysis in the SEM and handheld x-ray fluorescence analysis are then covered. The article ends with a discussion on the applications of x-ray spectroscopy in failure analysis.
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003549
EISBN: 978-1-62708-180-1
Abstract
This article provides an overview of the electrochemical nature of corrosion and analyzes corrosion-related failures. It describes corrosion failure analysis and discusses corrective and preventive approaches to mitigate corrosion-related failures of metals. These include: change in the environment; change in the alloy or heat treatment; change in design; use of galvanic protection; use of inhibitors; use of nonmetallic coatings and liners; application of metallic coatings; use of surface treatments, thermal spray, or other surface modifications; corrosion monitoring; and preventive maintenance.
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003529
EISBN: 978-1-62708-180-1
... to detect the various wavelength x-rays ( Fig. 5 ). This configuration is excellent for the quantitative analysis of flat samples but is awkward and time-consuming to set up and is difficult to use on irregular topography, such as a fracture surface. With the advent of semiconductor devices, a new type...
Abstract
This article describes some of the common elemental composition analysis methods and explains the concept of referee and economy test methods in failure analysis. It discusses different types of microchemical analyses, including backscattered electron imaging, energy-dispersive spectrometry, and wavelength-dispersive spectrometry. The article concludes with information on specimen handling.
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003526
EISBN: 978-1-62708-180-1
... and nonlinear properties of the parts and to apply any type of thermal cycle allows many failure analysis scenarios to be evaluated. The use of FEA in this area is expected to increase. Analysis of microelectromechanical systems (MEMS) typically made using semiconductor fabrication and processing techniques...
Abstract
This article provides information on the development of finite element analysis (FEA) and describes the general-purpose applications of FEA software programs in structural and thermal, static and transient, and linear and nonlinear analyses. It discusses special-purpose finite element applications in piping and pressure vessel analysis, impact analysis, and microelectronics. The article describes the steps involved in the design process using the FEA. It concludes with two case histories that involve the use of FEA in failure analysis.
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003533
EISBN: 978-1-62708-180-1
... in many respects to the specimen current, charge collection techniques are used extensively in the semiconductor industry ( Ref 3 ) whilst the EBSP signal is used to determine crystal structure and orientation ( Ref 4 ). More information concerning the use of these signals is available ( Ref 5 ). Vacuum...
Abstract
The scanning electron microscopy (SEM) is one of the most versatile instruments for investigating the microstructure of metallic materials. This article highlights the development of SEM technology and describes the operation of basic systems in an SEM, including the electron optical column, signal detection and display equipment, and vacuum system. It discusses the preparation of samples for observation using an SEM and describes the application of SEM in fractography. If the surface remains unaffected and undamaged by events subsequent to the actual failure, it is often a simple matter to determine the failure mode by the use of an SEM. In cases where the surface is altered after the initial failure, the case may not be so straightforward. The article presents typical examples that illustrate these points. Image dependence on the microscope type and operating parameters is also discussed.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006769
EISBN: 978-1-62708-295-2
...” in this Volume. Additional signals that can be monitored in an SEM are the specimen current and the electron backscattered diffraction (EBSD) pattern. Similar in many respects to the specimen current, charge-collection techniques are used extensively in the semiconductor industry ( Ref 4 ), while the EBSD...
Abstract
The scanning electron microscope (SEM) is one of the most versatile instruments for investigating the microscopic features of most solid materials. The SEM provides the user with an unparalleled ability to observe and quantify the surface of a sample. This article discusses the development of SEM technology and operating principles of basic systems of SEM. The basic systems covered include the electron optical column, signal detection and display equipment, and the vacuum system. The processes involved in the preparation of samples for observation using an SEM are described, and the application of SEM in fractography is discussed. The article covers the failure mechanisms of ductile failure, brittle failure, mixed-mode failure, and fatigue failure. Lastly, image dependence on microscope type and operating parameters is also discussed.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006782
EISBN: 978-1-62708-295-2
Abstract
Corrosion is the deterioration of a material by a reaction of that material with its environment. The realization that corrosion control can be profitable has been acknowledged repeatedly by industry, typically following costly business interruptions. This article describes the electrochemical nature of corrosion and provides the typical analysis of environmental- and corrosion-related failures. It presents common methods of testing of laboratory corrosion and discusses the processes involved in the prevention of environmental- and corrosion-related failures of metals and nonmetals.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006773
EISBN: 978-1-62708-295-2
.... Analysis of MEMS typically made using semiconductor fabrication and processing techniques is another potential application, and FEA applications designed for these special needs are becoming available. Impact Analysis Dynamic Impact is one of the most severe conditions that any design engineer has...
Abstract
When complex designs, transient loadings, and nonlinear material behavior must be evaluated, computer-based techniques are used. This is where the finite-element analysis (FEA) is most applicable and provides considerable assistance in design analysis as well as failure analysis. This article provides a general view on the applicability of finite-element modeling in conducting analyses of failed components. It highlights the uses of finite-element modeling in the area of failure analysis and design, with emphasis on structural analysis. The discussion covers the general development and both general- and special-purpose applications of FEA. The special-purpose applications of FEA covered are piping and pressure vessel analysis, impact analysis, and microelectronic and microelectromechanical systems analysis. The article provides case histories that involved the use of FEA in failure analysis.
Series: ASM Handbook
Volume: 11B
Publisher: ASM International
Published: 15 May 2022
DOI: 10.31399/asm.hb.v11B.a0006943
EISBN: 978-1-62708-395-9
Series: ASM Handbook
Volume: 11B
Publisher: ASM International
Published: 15 May 2022
DOI: 10.31399/asm.hb.v11B.a0006911
EISBN: 978-1-62708-395-9
... methods include the use of strain gage load cells, and displacement-based probes. Resistance and semiconductor strain gage load cells have an array of strain gages calibrated to measure force in one or more principal direction, from a single-axis force or torque measurement to multi-axis load cells which...
Abstract
Tribology is the study of contacting materials in relative motion and more specifically the study of friction, wear, and lubrication. This article discusses the classification and the mechanisms of friction, wear, and lubrication of polymers. It describes the tribological applications of polymers and the tribometers and instrumentation used to measure the tribological properties of polymers. The article discusses the processes involved in calculating the wear rate of polymers and the methods of characterization of the sliding interface. It provides information on the pressure and velocity limit of polymer composites and polymer testing best practices.
Series: ASM Handbook
Volume: 11B
Publisher: ASM International
Published: 15 May 2022
DOI: 10.31399/asm.hb.v11B.a0006915
EISBN: 978-1-62708-395-9
... pathways for conduction through insulating polymer matrices. Finally, highly conjugated polymers such as polyacetylene and polyaniline provide sufficient electron movement to reach semiconductor conductivity. For full conductivity, they rely on dopants. Mechanical analogs to purely elastic Hookean...
Abstract
This article provides practical information and data on property development in engineering plastics. It discusses the effects of composition on submolecular and higher-order structure and the influence of plasticizers, additives, and blowing agents. It examines stress-strain curves corresponding to soft-and-weak, soft-and-tough, hard-and-brittle, and hard-and-tough plastics and temperature-modulus plots representative of polymers with different degrees of crystallinity, cross-linking, and polarity. It explains how viscosity varies with shear rate in polymer melts and how processes align with various regions of the viscosity curve. It discusses the concept of shear sensitivity, the nature of viscoelastic properties, and the electrical, chemical, and optical properties of different plastics. It also reviews plastic processing operations, including extrusion, injection molding, and thermoforming, and addresses related considerations such as melt viscosity and melt strength, crystallization, orientation, die swell, melt fracture, shrinkage, molded-in stress, and polymer degradation.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006768
EISBN: 978-1-62708-295-2
... limited to polycrystalline materials ( Ref 6 ), that is, in materials with a grain structure (long-range ordering) as normally found in metals and their alloys as well as in polycrystalline ceramics (i.e., oxides, carbides, nitrides, etc.). Exceptions occur in semiconductor analysis in which strain (Eq 2...
Abstract
X-ray diffraction (XRD) residual-stress analysis is an essential tool for failure analysis. This article focuses primarily on what the analyst should know about applying XRD residual-stress measurement techniques to failure analysis. Discussions are extended to the description of ways in which XRD can be applied to the characterization of residual stresses in a component or assembly and to the subsequent evaluation of corrective actions that alter the residual-stress state of a component for the purposes of preventing, minimizing, or eradicating the contribution of residual stress to premature failures. The article presents a practical approach to sample selection and specimen preparation, measurement location selection, and measurement depth selection; measurement validation is outlined as well. A number of case studies and examples are cited. The article also briefly summarizes the theory of XRD analysis and describes advances in equipment capability.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.9781627082952
EISBN: 978-1-62708-295-2
Series: ASM Handbook
Volume: 11B
Publisher: ASM International
Published: 15 May 2022
DOI: 10.31399/asm.hb.v11B.a0006924
EISBN: 978-1-62708-395-9
Abstract
This article discusses the most common thermal analysis methods for thermosetting resins. These include differential scanning calorimetry, thermomechanical analysis, thermogravimetric analysis, and dynamic mechanical analysis. The article also discusses the characterization of uncured thermosetting resins as well as the curing process. Then, the techniques to characterize the physical properties of cured thermosets and composites are presented. Several examples of stress-strain curves are shown for thermosets and thermoplastic polymers.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006764
EISBN: 978-1-62708-295-2
Abstract
Nondestructive testing (NDT), also known as nondestructive evaluation (NDE), includes various techniques to characterize materials without damage. This article focuses on the typical NDE techniques that may be considered when conducting a failure investigation. The article begins with discussion about the concept of the probability of detection (POD), on which the statistical reliability of crack detection is based. The coverage includes the various methods of surface inspection, including visual-examination tools, scanning technology in dimensional metrology, and the common methods of detecting surface discontinuities by magnetic-particle inspection, liquid penetrant inspection, and eddy-current testing. The major NDE methods for internal (volumetric) inspection in failure analysis also are described.
Series: ASM Handbook
Volume: 11B
Publisher: ASM International
Published: 15 May 2022
DOI: 10.31399/asm.hb.v11B.9781627083959
EISBN: 978-1-62708-395-9
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