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Book Chapter
Termination Delamination of Surface-Mount Chip Resistors
Available to PurchaseSeries: ASM Failure Analysis Case Histories
Volume: 2
Publisher: ASM International
Published: 01 December 1993
DOI: 10.31399/asm.fach.v02.c9001391
EISBN: 978-1-62708-215-0
... Abstract Several surface-mount chip resistor assemblies failed during monthly thermal shock testing and in the field. The resistor exhibited a failure mode characterized by a rise in resistance out of tolerance for the system. Representative samples from each step in the manufacturing process...
Abstract
Several surface-mount chip resistor assemblies failed during monthly thermal shock testing and in the field. The resistor exhibited a failure mode characterized by a rise in resistance out of tolerance for the system. Representative samples from each step in the manufacturing process were selected for analysis, along with additional samples representing the various resistor failures. Visual examination revealed two different types of termination failures: total delamination and partial delamination. Electron probe microanalysis confirmed that the fracture occurred at the end of the termination. Transverse sections from each of the groups were examined metallographically. Consistent interfacial separation was noted. Fourier transform infrared and EDS analyses were also performed. It was concluded that low wraparound termination strength of the resistors had caused unacceptable increases in the resistance values, resulting in circuit nonperformance at inappropriate times. The low termination strength was attributed to deficient chip design for the intended materials and manufacturing process and exacerbated by the presence of polymeric contamination at the termination interface.
Image
Group 1 (left) and Group 2 resistors. The group 2 resistor had been exposed...
Available to Purchase
in Termination Delamination of Surface-Mount Chip Resistors
> Handbook of Case Histories in Failure Analysis
Published: 01 December 1993
Fig. 2 Group 1 (left) and Group 2 resistors. The group 2 resistor had been exposed to the heat of soldering for 90 s. Note the dark appearance of the top polymer coating. This is due to the pyrolysis, or breakdown, of the epoxy coating. 19.25×
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Image
An interesting detail on the group 1 resistors was the presence of an amorp...
Available to Purchase
in Termination Delamination of Surface-Mount Chip Resistors
> Handbook of Case Histories in Failure Analysis
Published: 01 December 1993
Fig. 8 An interesting detail on the group 1 resistors was the presence of an amorphous dark-appearing phase dotting the interface between the cermet metallization and the thick-film polymer conductive ink. Fourier transform infrared analysis determined that this dark-appearing phase
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Image
Delaminated group 8 resistor that exhibited a low pushoff strength. Note th...
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in Termination Delamination of Surface-Mount Chip Resistors
> Handbook of Case Histories in Failure Analysis
Published: 01 December 1993
Fig. 3 Delaminated group 8 resistor that exhibited a low pushoff strength. Note the puckered appearance of the gold polymer coating at the left termination. This was caused by the heat of soldering exceeding the T g of the epoxy. 21.6×
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Image
SEM micrograph of a resistor with a partially delaminated termination. The ...
Available to Purchase
in Termination Delamination of Surface-Mount Chip Resistors
> Handbook of Case Histories in Failure Analysis
Published: 01 December 1993
Fig. 4 SEM micrograph of a resistor with a partially delaminated termination. The light-appeahng portion is the lead-tin alloy on the surface of the termination. The dark-appearing area beneath the lead-tin alloy is exposed alumina.
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Image
SEM micrograph of a group 2 resistor termination. Areas of interest are as ...
Available to Purchase
in Termination Delamination of Surface-Mount Chip Resistors
> Handbook of Case Histories in Failure Analysis
Published: 01 December 1993
Fig. 11 SEM micrograph of a group 2 resistor termination. Areas of interest are as follows: area 1 is the alumina substrata area 2 is the cermet thick-film metallization; area 3 is the polymer thick-film ink; area 4 is the nickel barrier layer; and area 5 is the lead-tin surface coa ting
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Image
Interface on a group 3 resistor. Note the increased thickness at the critic...
Available to Purchase
in Termination Delamination of Surface-Mount Chip Resistors
> Handbook of Case Histories in Failure Analysis
Published: 01 December 1993
Fig. 12 Interface on a group 3 resistor. Note the increased thickness at the critical interface. This was caused by the forces exerted by the expansion and contraction of the silver carrier plate during soldering. The polymer contamination (most likely resin separation from the epoxy thick
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Image
Higher-magnification examination of the surface of the delaminated portion ...
Available to Purchase
in Termination Delamination of Surface-Mount Chip Resistors
> Handbook of Case Histories in Failure Analysis
Published: 01 December 1993
Fig. 6 Higher-magnification examination of the surface of the delaminated portion of the resistor termination. Note the absence of evidence of any type of fracture or tearing on the surface.
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Book Chapter
Hydrogen-Stress Cracking of Type 410 Stainless Steel Splice Case Bolts
Available to PurchaseSeries: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.mech.c0006899
EISBN: 978-1-62708-225-9
.... The bolts (cathodes) were connected to the negative terminal of a battery through a current-limiting resistor against a platinum anode and cathodically charged with hydrogen. The time to failure was measured. All type 410 stainless steel bolts were quenched from 1010 to 65 °C (1850 to 150 °F) in oil...
Abstract
Type 410 stainless steel bolts were used to hold together galvanized gray cast iron splice case halves. Before installation, the bolts were treated with molybdenum disulfide (MoS 2 ) antiseize compound. Several failures of splice case bolts were discovered in flooded manholes after they were in service for three to four months. Laboratory experiments were conducted to determine if the failure mode was hydrogen-stress cracking, if sulfides accelerate the failure, if heat treatment can improve the resistance against this failure mode, and if the type 305 austenitic stainless steel would serve as a replacement material. Based on test results, the solution to the hydrogen-stress cracking problem consisted of changing the bolt from type 410 to 305 stainless steel, eliminating use of MoS2, and limiting the torque to 60 N·m (540 in.·lb).
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003501
EISBN: 978-1-62708-180-1
... Shafts, connecting rods, gears Electricity Wires, lightbulb elements, resistors Provide a barrier (for example: reflect, cover, enclose, or protect) Light Walls, plugs, caps Heat Thermal insulators, thermal reflecting surfaces Electricity Electrical insulators, magnetic shields...
Abstract
Materials selection is an important engineering function in both the design and failure analysis of components. This article briefly reviews the general aspects of materials selection as a concern in proactive failure prevention during design and as a possible root cause of failed parts. It discusses the overall concept of design and describes the role of the materials engineer in the design and materials selection process. The article highlights the significance of materials selection in both the prevention and analysis of failures.
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006800
EISBN: 978-1-62708-329-4
... Shafts, connecting rods, gears Electricity Wires, lightbulb elements, resistors Provide a barrier (for example, reflect, cover, enclose, or protect) Light Walls, plugs, caps Heat Thermal insulators, thermal reflecting surfaces Electricity Electrical insulators, magnetic shields...
Abstract
Materials selection is closely related to the objectives of failure analysis and prevention. This article briefly reviews the general aspects of materials selection as a concern in both proactive failure prevention during design and as a possible root cause of failed parts. Coverage is more conceptual, with general discussions on the following topics: design and failure prevention, materials selection in design, materials selection for failure prevention, and materials selection and failure analysis. Because materials selection is just one part of the design process, the overall concept of design is discussed. The article also describes the role of the materials engineer in the design and materials selection process. It provides information on the significance of materials selection in both the prevention and analysis of failures.
Book Chapter
Nondestructive Testing in Failure Analysis
Available to PurchaseSeries: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006764
EISBN: 978-1-62708-295-2
Abstract
Nondestructive testing (NDT), also known as nondestructive evaluation (NDE), includes various techniques to characterize materials without damage. This article focuses on the typical NDE techniques that may be considered when conducting a failure investigation. The article begins with discussion about the concept of the probability of detection (POD), on which the statistical reliability of crack detection is based. The coverage includes the various methods of surface inspection, including visual-examination tools, scanning technology in dimensional metrology, and the common methods of detecting surface discontinuities by magnetic-particle inspection, liquid penetrant inspection, and eddy-current testing. The major NDE methods for internal (volumetric) inspection in failure analysis also are described.