Several surface-mount chip resistor assemblies failed during monthly thermal shock testing and in the field. The resistor exhibited a failure mode characterized by a rise in resistance out of tolerance for the system. Representative samples from each step in the manufacturing process were selected for analysis, along with additional samples representing the various resistor failures. Visual examination revealed two different types of termination failures: total delamination and partial delamination. Electron probe microanalysis confirmed that the fracture occurred at the end of the termination. Transverse sections from each of the groups were examined metallographically. Consistent interfacial separation was noted. Fourier transform infrared and EDS analyses were also performed. It was concluded that low wraparound termination strength of the resistors had caused unacceptable increases in the resistance values, resulting in circuit nonperformance at inappropriate times. The low termination strength was attributed to deficient chip design for the intended materials and manufacturing process and exacerbated by the presence of polymeric contamination at the termination interface.

Type 410 stainless steel bolts were used to hold together galvanized gray cast iron splice case halves. Before installation, the bolts were treated with molybdenum disulfide (MoS 2 ) antiseize compound. Several failures of splice case bolts were discovered in flooded manholes after they were in service for three to four months. Laboratory experiments were conducted to determine if the failure mode was hydrogen-stress cracking, if sulfides accelerate the failure, if heat treatment can improve the resistance against this failure mode, and if the type 305 austenitic stainless steel would serve as a replacement material. Based on test results, the solution to the hydrogen-stress cracking problem consisted of changing the bolt from type 410 to 305 stainless steel, eliminating use of MoS2, and limiting the torque to 60 N·m (540 in.·lb).

Materials selection is an important engineering function in both the design and failure analysis of components. This article briefly reviews the general aspects of materials selection as a concern in proactive failure prevention during design and as a possible root cause of failed parts. It discusses the overall concept of design and describes the role of the materials engineer in the design and materials selection process. The article highlights the significance of materials selection in both the prevention and analysis of failures.

Nondestructive testing (NDT), also known as nondestructive evaluation (NDE), includes various techniques to characterize materials without damage. This article focuses on the typical NDE techniques that may be considered when conducting a failure investigation. The article begins with discussion about the concept of the probability of detection (POD), on which the statistical reliability of crack detection is based. The coverage includes the various methods of surface inspection, including visual-examination tools, scanning technology in dimensional metrology, and the common methods of detecting surface discontinuities by magnetic-particle inspection, liquid penetrant inspection, and eddy-current testing. The major NDE methods for internal (volumetric) inspection in failure analysis also are described.