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Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.process.c9001493
EISBN: 978-1-62708-235-8
... Abstract An open electrical circuit was found between plated through-holes in a six-layer printed circuit board after thermal cycling. The copper plating was very thin in the failure area but did make an electrical contact during initial testing. During thermal cycling, differential z-expansion...
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Published: 30 August 2021
Fig. 24 Simplified daisy chain circuit. PCB, printed circuit board; NSMD, nonsolder mask defined; ENIG, electroless nickel and immersion gold More
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.process.c9001492
EISBN: 978-1-62708-235-8
... Abstract Electroless nickel plating separation from copper alloy CDA175 retaining clips used on printed circuit boards was caused by a copper oxide layer that reduced adhesion of the nickel plating on the clips. Stresses that developed during module insertion caused flaking to occur...
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Published: 15 January 2021
Fig. 13 Energy-dispersive spectrometer (EDS) line scan on a polished cross at the bond interface of a solder joint for a component on a printed circuit board. A high concentration of phosphorus indicates degradation of the electroless nickel plating during subsequent gold plating More
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Published: 30 August 2021
Fig. 10 Schematic demonstration of typical cold soldering. PCB, printed circuit board More
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Published: 30 August 2021
Fig. 18 Intermetallic compound brittle failure of a solder joint. PCB, printed circuit board More
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Published: 30 August 2021
Fig. 5 Schematic diagram and failure modes of a solder joint. IMC, intermetallic compound; PCB, printed circuit board More
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Published: 30 August 2021
Fig. 15 Solder mask defined and nonsolder mask defined pad opening configurations. PCB, printed circuit board More
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Published: 30 August 2021
Fig. 11 Formation of a cold-soldered joint caused by warpage. PCB, printed circuit board; BGA, ball grid array More
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Published: 30 August 2021
Fig. 20 Schematic representation of development of thermal-cycling-induced strains in a ceramic ball grid array package. PCB, printed circuit board More
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Published: 30 August 2021
Fig. 25 Pad cratering is not associated with the trace being broken at the beginning. PCB, printed circuit board. Source: Ref 37 . © 2016 IEEE. Reprinted, with permission, from IEEE Proceedings More
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
... between the bulk soldering area and printed circuit board (PCB) Conductive layer on the PCB Nonconductive part at the PCB Figure 5 shows a schematic diagram and failure modes for the solder joint system defined by the Interconnection and Packaging Circuits (IPC) 9708 standard. Fig. 5...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006770
EISBN: 978-1-62708-295-2
... is very useful to illustrate abrupt or gradual composition variations at areas of interest on a sample surface or prepared specimen. Figure 13 shows a line scan on a metallographically prepared section of a printed circuit board with multiple failed solder connections. The line scans indicate...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.9781627081801
EISBN: 978-1-62708-180-1
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0006548
EISBN: 978-1-62708-180-1
... Occupational Safety and Health Ad- ministration p page P applied load ppm parts per million psi pounds per square inch PA polyamide PAN polyacrylonitrile PBI polybensimidazole PBT polybutylene terephthalate PC polycarbonate PCB printed circuit board PC/PET polycarbonate/polyethylene tere- phthalate PDF...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006764
EISBN: 978-1-62708-295-2
... input, and high-resolution instrument. IR systems are sensitive to surface emissivity. Rapid examination of large areas. Can be adapted to production inspections Circuit board solder joints, solar cells, heat-transfer equipment, metals, composites, concrete Sonic IR/vibro-thermography, inductive IR...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003526
EISBN: 978-1-62708-180-1
... that must be analyzed, and many of the critical materials have nonlinear properties. There are micro-heat-generation sources inside chip packages and global printed circuit board cooling considerations that interact. These temperature conditions cause macrothermal distortions of the entire printed circuit...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006773
EISBN: 978-1-62708-295-2
... makes analysis of microelectronic components complex is that there are considerable thermal transient and cyclic effects that must be analyzed, and many of the critical materials have nonlinear properties. There are micro-heat-generation sources inside chip packages and global printed circuit board...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003560
EISBN: 978-1-62708-180-1
... crusher wear, electronic circuit board drill wear, grinding plate wear failure analysis, impact wear of disk cutters, and identification of abrasive wear modes in martensitic steels. abrasive wear failures abrasive wear mechanisms adhesive wear erosive-type wear wear failure analysis...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.9781627082952
EISBN: 978-1-62708-295-2