This article provides a discussion on the metallographic techniques used for failure analysis, and on fracture examination in materials, with illustrations. It discusses various metallographic specimen preparation techniques, namely, sectioning, mounting, grinding, polishing, and electrolytic polishing. The article also describes the microstructure examination of various materials, with emphasis on failure analysis, and concludes with information on the examination of replicas with light microscopy.

Metallographic examination is one of the most important procedures used by metallurgists in failure analysis. Typically, the light microscope (LM) is used to assess the nature of the material microstructure and its influence on the failure mechanism. Microstructural examination can be performed with the scanning electron microscope (SEM) over the same magnification range as the LM, but examination with the latter is more efficient. This article describes the major operations in the preparation of metallographic specimens, namely sectioning, mounting, grinding, polishing, and etching. The influence of microstructures on the failure of a material is discussed and examples of such work are given to illustrate the value of light microscopy. In addition, information on heat-treatment-related failures, fabrication-/machining-related failures, and service failures is provided, with examples created using light microscopy.

Fractography is the means and methods for characterizing a fractured specimen or component. This includes the examination of fracture-exposed surfaces and the interpretation of the fracture markings as well as the examination and interpretation of crack patterns. This article describes the former of these two parts of fractography. It presents the techniques of fractography and explains fracture markings using glass and ceramic examples. The article also discusses the fracture modes in ceramics and provides examples of fracture origins.

Mechanical testing is an evaluative tool used by the failure analyst to collect data regarding the macro- and micromechanical properties of the materials being examined. This article provides information on a few important considerations regarding mechanical testing that the failure analyst must keep in mind. These considerations include the test location and orientation, the use of raw material certifications, the certifications potentially not representing the hardware, and the determination of valid test results. The article introduces the concepts of various mechanical testing techniques and discusses the advantages and limitations of each technique when used in failure analysis. The focus is on various types of static load testing, hardness testing, and impact testing. The testing types covered include uniaxial tension testing, uniaxial compression testing, bend testing, hardness testing, macroindentation hardness, microindentation hardness, and the impact toughness test.

Thermomechanical fatigue (TMF) refers to the process of fatigue damage under simultaneous changes in temperature and mechanical strain. This article reviews the process of TMF with a practical example of life assessment. It describes TMF damages caused due to two possible types of loading: in-phase and out-of-phase cycling. The article illustrates the ways in which damage can interact at high and low temperatures and the development of microstructurally based models in parametric form. It presents a case study of the prediction of residual life in a turbine casing of a ship through stress analysis and fracture mechanics analyses of the casing.

This article describes the preliminary stages and general procedures, techniques, and precautions employed in the investigation and analysis of metallurgical failures that occur in service. The most common causes of failure characteristics are described for fracture, corrosion, and wear failures. The article provides information on the synthesis and interpretation of results from the investigation. Finally, it presents key guidelines for conducting a failure analysis.