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microelectronic circuit failure analysis

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Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
... Analysis Techniques for Solder Joint Failures References References 1. Puttlitz K.J. and Stalter K.A. , Handbook of Lead-Free Solder Technology for Microelectronic Assemblies , CRC Press , 2004 10.1201/9780203021484 2. Ma H. and Suhling J.C. , A Review...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003526
EISBN: 978-1-62708-180-1
... applications in piping and pressure vessel analysis, impact analysis, and microelectronics. The article describes the steps involved in the design process using the FEA. It concludes with two case histories that involve the use of FEA in failure analysis. References References 1. Love E.H...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006773
EISBN: 978-1-62708-295-2
... in failure analysis. finite-element modeling impact analysis microelectromechanical systems microelectronic systems pressure vessels structural analysis Introduction General Development of Finite-Element Analysis General-Purpose Applications Special-Purpose Applications Design...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.9781627082952
EISBN: 978-1-62708-295-2