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Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.modes.c9001674
EISBN: 978-1-62708-234-1
... Abstract Accelerated aging tests on detonator assemblies, to verify the compatibility of gold bridgewire and Pd-In-Sn solder with the intended explosives, revealed an unusual form of corrosion. The tests, conducted at 74 deg C (165 deg F) and 54 deg C (130 deg F), indicated a preferential...
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Published: 01 January 2002
Fig. 20 Affect of accelerating voltage on imaging. Sample is gold-coated ZnS powders imaged using (a) 25 kV and (b) 5 kV. Note enhanced surface information at 5 kV. Both 20,000× More
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Published: 01 June 2019
Fig. 1 Electroless nickel underplating and gold plating on a copper alloy CDA175 module retaining clip. (a) shows a good plated clip and (b) shows a bad clip with copper oxide (black layer) at the copper/alloy nickel plating interface, where the separation occurred. More
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Published: 15 January 2021
Fig. 20 Effect of accelerating voltage on imaging. Sample is gold-coated ZnS powders imaged using (a) 25 and (b) 5 kV. Note enhanced surface information at 5 kV. Original magnification of both: 20,000× More
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Published: 15 May 2022
Fig. 6 SEM images from gold-sputter-coated polyvinyl chloride fractured by impact at room temperature, showing brittle fracture. (a) Secondary electron image. Original magnification 500×. (b) Backscattered electron image. Original magnification 500× More
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Published: 15 May 2022
Fig. 10 Gold coating damage in a Pebax catheter tip containing tungsten particles for opacity. (a) Without charging prior to damage. Original magnification: 4300×. (b) With charging after damage due to aging, appearing as light streaks. Original magnification: 5000× More
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Published: 01 December 2019
Fig. 5 A micrograph of the fracture surface (gold coated) of Fig. 4 revealing multiple crack origins, a smooth morphology, and arrest marks More
Series: ASM Failure Analysis Case Histories
Volume: 1
Publisher: ASM International
Published: 01 December 1992
DOI: 10.31399/asm.fach.v01.c9001021
EISBN: 978-1-62708-214-3
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.process.c9001494
EISBN: 978-1-62708-235-8
... Abstract Diode leads that were to be made from OFHC copper were instead made from copper with high oxygen content. The leads had a nickel underplating, a gold final plating, and were brazed to the diode package in a hydrogen atmosphere. After brazing, the leads became embrittled. SEM...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.modes.c0006440
EISBN: 978-1-62708-234-1
... microscopy. The corrosion product contained molybdenum and copper with a trace of gold. The base material was analyzed as molybdenum with negligible alloying additions. The primary mode of corrosion attack on the base material appeared to be intergranular, although uniform corrosion was evident also...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.process.c0047756
EISBN: 978-1-62708-235-8
... extremities of a granular gold-tinted surface region adjacent to the tube-to-sleeve brazed joint and extending circumferentially were revealed by microscopic examination. Embrittlement of the tube caused by molten braze metal penetration along grain boundaries was evidenced by micrographs of a granular...
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Published: 01 January 2002
Fig. 45 Fracture surface of a Cu-25Au (at.%) single crystal upon bending in air following 30 day stress-free immersion in aqueous FeCl 3 . (a) Scanning electron micrograph of fracture surface of gold sponge. (b) Scanning electron micrograph of the boxed area showing facet-step structure More
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Published: 15 January 2021
Fig. 45 Fracture surface of a Cu-25Au (at.%) single crystal upon bending in air following 30 day stress-free immersion in aqueous FeCl 3 . (a) Scanning electron micrograph of fracture surface of gold sponge. (b) Scanning electron micrograph of the boxed area showing facet-step structure More
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Published: 15 January 2021
Fig. 6 Scanning electron microscope image of 15-5 precipitation-hardened (PH) steel debris with gold plating that had transferred onto the metal surface during the failure event. In secondary electron imaging, topographical differences in the gold plating such as wrinkling are more evident More
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.process.c9001492
EISBN: 978-1-62708-235-8
... thick gold plating. When the printed circuit board modules were inserted in the clips, shear and/or tensile stresses were generated at the copper base alloy/nickel plating and nickel/gold plating interfaces, depending on the location of the clip. The clips with plating failures and some good clips were...
Series: ASM Failure Analysis Case Histories
Volume: 2
Publisher: ASM International
Published: 01 December 1993
DOI: 10.31399/asm.fach.v02.c9001391
EISBN: 978-1-62708-215-0
... Electronic devices Gold Lead-tin Polymer (Other, miscellaneous, or unspecified) failure Background Several surface-mount chip resistor assemblies failed during monthly thermal shock testing and in the field. Circumstances Leading to Failure The resistor, the only electrically active...
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Published: 01 December 1993
Fig. 8 Energy dispersive spectra showing titanium and nitrogen on the surface. Sample after gold sputter coating. 500×. More
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Published: 01 June 2019
Fig. 6 EDS chemical analysis of the black foam insulation reveals a high level of chlorine. Sample is sputter-coated with gold. More
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Published: 30 August 2021
Fig. 24 Simplified daisy chain circuit. PCB, printed circuit board; NSMD, nonsolder mask defined; ENIG, electroless nickel and immersion gold More
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Published: 01 June 2019
Fig. 2 Cross-section of an OFHC copper diode lead with nickel underplating and gold plating. Plating cracked due to excessive back and forth bending of the lead, exposing the copper to oxidize, causing lead separation. More