Electroless nickel plating separation from copper alloy CDA175 retaining clips used on printed circuit boards was caused by a copper oxide layer that reduced adhesion of the nickel plating on the clips. Stresses that developed during module insertion caused flaking to occur at the oxidized copper surface. Electroless nickel plating separation from OFHC copper leads was caused by improper handling rather than a plating anomaly per se. Tin plating separation from copper underplating on a hybrid package lid occurred because of a four-week delay between the copper plating and tin plating steps. It was recommended that tin plating should follow the copper underplating within 24 h and a cleaning step of bright dipping after copper plating be performed.

Accelerated aging tests on detonator assemblies, to verify the compatibility of gold bridgewire and Pd-In-Sn solder with the intended explosives, revealed an unusual form of corrosion. The tests, conducted at 74 deg C (165 deg F) and 54 deg C (130 deg F), indicated a preferential attack of the gold. To investigate the problem, a matrix of test units was produced and analyzed. Scanning electron microscopy, EDX analysis, and x-ray diffraction techniques were used to determine the extent of the corrosion and identify the corrosion products. The results indicated that the preferential attack of the gold was due to HCN formed by decomposition of the explosive powder at high temperatures. Other associated reactions were also observed including the subsequent attack of the solder by the gold corrosion product and degradation of the plastic header.

The scanning electron microscopy (SEM) is one of the most versatile instruments for investigating the microstructure of metallic materials. This article highlights the development of SEM technology and describes the operation of basic systems in an SEM, including the electron optical column, signal detection and display equipment, and vacuum system. It discusses the preparation of samples for observation using an SEM and describes the application of SEM in fractography. If the surface remains unaffected and undamaged by events subsequent to the actual failure, it is often a simple matter to determine the failure mode by the use of an SEM. In cases where the surface is altered after the initial failure, the case may not be so straightforward. The article presents typical examples that illustrate these points. Image dependence on the microscope type and operating parameters is also discussed.

The scanning electron microscope (SEM) is one of the most versatile instruments for investigating the microscopic features of most solid materials. The SEM provides the user with an unparalleled ability to observe and quantify the surface of a sample. This article discusses the development of SEM technology and operating principles of basic systems of SEM. The basic systems covered include the electron optical column, signal detection and display equipment, and the vacuum system. The processes involved in the preparation of samples for observation using an SEM are described, and the application of SEM in fractography is discussed. The article covers the failure mechanisms of ductile failure, brittle failure, mixed-mode failure, and fatigue failure. Lastly, image dependence on microscope type and operating parameters is also discussed.

After completing a fatigue test of an aluminum alloy component machined from a 7079-T6 forging, technicians noted a 5 in. crack which ran longitudinally above and through the flange. When the fracture face was examined by light microscopy, observers could not ascertain the exact mode of fracture. Electron fractography revealed that five different modes of crack growth were operative as the part failed. Region 1 was a shallow zone (about 0.002 in. at its deepest) of dimpled structure typical of an overload failure. Region 2 was a zone that grew by a stress corrosion mechanism. Through a fatigue mechanism was operative in Region 3, it was not the cause of the large crack. Region 4, which covered 50% of the fracture area, developed mainly by stress corrosion. This zone gradually changed into the combination of intergranular and transgranular overload in Region 5, which covered approximately the remaining 50% of the fracture. Apparently, after stress corrosion moved halfway through, the part failed by overload. This failure analysis proved that a crack, originally thought to be a fatigue failure, was actually a stress corrosion crack.

A forging of 7075-T6 aluminum alloy, which formed a support for the cylinder of a cargo door, cracked at an attachment hole. Fluorescent penetrant inspection showed the crack ran above and below the hole out onto the machined flat surface of the flange. A 6500x electron fractograph proved the crack to be a forging defect called a cold shut. Because defects of this type are usually detected when the raw forging is inspected, this occurrence was considered to be an isolated instance.

Examination of a cracked nose landing gear cylinder made of AISI 4340 Cr-Mo-Ni alloy steel proved that the part started to fail on the inside diam. When the nucleus of the stress-corrosion crack was studied in detail, iron oxide was found on the fracture surface. A 6500x micrograph revealed this area also displayed an intergranular texture. One of a group of small grinding cracks on the ID of the cylinder nucleated the failure. Other evidence indicated the cracks developed when the cylinder was ground during overhaul.

Overhaul mechanics discovered a crack in an AISI 4340 Cr-Mo-Ni alloy steel pivot bolt when grinding off the chromium plating. The bolt had served for an estimated 10,000 h and was replated when last overhauled. On checking the bolt, several fine cracks were found on the surface. A 6500x micrograph revealed the intergranular nature of a crack. By trying different grinding procedures, investigators were able to reproduce this type of failure in the laboratory. It was concluded that grinding cracks initiated the failure. It should be noted that governing specifications prohibit grinding on high-strength steel; chromium should be stripped by electrochemical methods.

A 9310 steel gear was found to be defective after a period of engine service. A linear crack approximately was discovered by routine magnetic-particle inspection of an electron beam welded joint that attached a hollow stub shaft to the web of the gear. The welding procedure had a cosmetic weld pass on top of the initial full-penetration weld. There were no other known service failures of gears were welded by this method. One zone of the welded joint showed incomplete fusion, surrounded by two zones containing fatigue beach marks This indicated that the incomplete-fusion zone was the site at which primary fracture originated. The possible causes of incomplete-fusion include localized magnetic deflection of the electron beam, a momentary arc-out of the electron beam, and eccentricity in the small weld diam. The failure was attributed to fatigue originating at the local unfused interface of the electron beam weld, which had been the result of a deviation in the welding procedure. Examination of the possible causes of failure gave no evidence that a recurrence of the defect had ever occurred. Thus, there was no basis on which to recommend a change in design, material, or welding procedure.

This article provides information on the chemical characterization of surfaces by Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and time-of-flight secondary ion mass spectrometry (TOF-SIMS). It describes the basic theory behind each of these techniques, the types of data produced from each, and some typical applications. The article explains the strengths of AES, XPS, and TOF-SIMS based on data obtained from the surface of a slightly corroded stainless steel sheet.

This article covers the three most popular techniques used to characterize the very outermost layers of solid surfaces: Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and time-of-flight secondary ion mass spectrometry (TOF-SIMS). Some of the more important attributes are listed for preliminary insight into the strengths and limitations of these techniques for chemical characterization of surfaces. The article describes the basic theory behind each of the different techniques, the types of data produced from each, and some typical applications. Also discussed are the different types of samples that can be analyzed and the special sample-handling procedures that must be implemented when preparing to do failure analysis using these surface-sensitive techniques. Data obtained from different material defects are presented for each of the techniques. The examples presented highlight the typical data sets and strengths of each technique.

A steel pot used as crucible in a magnesium alloy foundry developed a leak that resulted in a fire and caused extensive damage. Hypotheses as to the cause of the leak included a defect in the pot, overuse, overheating, and poor foundry practices. Scanning electron microscopy, transmission electron microscopy, optical microscopy, and x-ray microanalysis in conjunction with dimensional analysis, phase diagrams and thermodynamics considerations were employed to evaluate the various hypotheses. All evidence pointed to an oxide mass in the area where the hole developed, likely introduced during the steelmaking process.