1-2 of 2 Search Results for

OFHC copper

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.process.c9001494
EISBN: 978-1-62708-235-8
... Abstract Diode leads that were to be made from OFHC copper were instead made from copper with high oxygen content. The leads had a nickel underplating, a gold final plating, and were brazed to the diode package in a hydrogen atmosphere. After brazing, the leads became embrittled. SEM...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.process.c9001492
EISBN: 978-1-62708-235-8
... oxidized copper surface. Electroless nickel plating separation from OFHC copper leads was caused by improper handling rather than a plating anomaly per se. Tin plating separation from copper underplating on a hybrid package lid occurred because of a four-week delay between the copper plating and tin...