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Intermetallic

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Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.design.c0046079
EISBN: 978-1-62708-233-4
... intergranular phase, resulting in failure by brittle fracture at low impact loads during handling and storage. Recommendation included manufacture of the pipe with aluminized instead of galvanized steel sheet for the combustion chamber. Galvanized steels Heating equipment Intermetallic Zinc compounds...
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Published: 01 January 2002
Fig. 57 Sigma (σ) phase in cast heat-resistant alloy HH, type II. Intermetallic phases, such as σ, can greatly reduce the ductility of many high-temperature alloys in service at temperatures from 480 to 955 °C (900 to 1750 °F). More
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Published: 30 August 2021
Fig. 33 Sigma (σ) phase in cast heat-resistant alloy HH, type II. Intermetallic phases, such as σ, can greatly reduce the ductility of many high-temperature alloys in service at temperatures from 480 to 955 °C (900 to 1750 °F). More
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Published: 30 August 2021
Fig. 4 Copper-tin (Cu 6 Sn 5 ) and silver-tin (Ag 3 Sn) intermetallic compound morphology in a solder ball More
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Published: 30 August 2021
Fig. 5 Schematic diagram and failure modes of a solder joint. IMC, intermetallic compound; PCB, printed circuit board More
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Published: 30 August 2021
Fig. 13 Typical growth kinetics of a copper-tin-base intermetallic compound. Source: Ref 31 . Courtesy of Springer Nature More
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Published: 30 August 2021
Fig. 14 Impact fracture energy of copper-tin intermetallic compounds. Source: Ref 26 . © 2013 IEEE. Reprinted, with permission, from IEEE Proceedings More
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Published: 30 August 2021
Fig. 18 Intermetallic compound brittle failure of a solder joint. PCB, printed circuit board More
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Published: 30 August 2021
Fig. 21 Typical intermetallic compound brittle fracture caused by impact More
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Published: 01 June 2019
Fig. 4 Boundary melting and large intermetallics were found near the fracture. Magnification 320 times. More
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Published: 01 June 2019
Fig. 5 On impact sample, white arrows point out intermetallics and dark arrows indicate grain boundary melting. Magnification 840 times. More
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.homegoods.c0049838
EISBN: 978-1-62708-222-8
... intermetallic compounds found in the aluminum-iron phase diagram. Similar compositional variations were noted at the aluminum/brass interface. It was concluded that the failure of the electrical junction due to extreme heating was related to the formation of intermetallic compounds at the current carrying...
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Published: 30 August 2021
Fig. 6 Dissimilar-metal expansion joint failure. (a) Diagram showing the expansion joint braze where the intermetallic formed. (b) Cross section showing the intermetallic layer. Original magnification: 15×. (c) Cracked intermetallic between the copper braze (top) and the stainless steel weld More
Series: ASM Failure Analysis Case Histories
Volume: 3
Publisher: ASM International
Published: 01 December 2019
DOI: 10.31399/asm.fach.v03.c9001753
EISBN: 978-1-62708-241-9
...-cast alloy, AA 712.0. Metallographic evaluation via optical microscopy and scanning electron microscopy revealed a high degree of porosity in the microstructure as well as the presence of deleterious intermetallic compounds within interdendritic regions. Macrohardness testing produced hardness values...
Series: ASM Failure Analysis Case Histories
Volume: 1
Publisher: ASM International
Published: 01 December 1992
DOI: 10.31399/asm.fach.v01.c9001031
EISBN: 978-1-62708-214-3
.... 85×. Microprobe Analysis Microprobe analysis was used to determine the morphology and composition of the matrix and phases. Typical microstructure of NARloy-Z was observed away from the banded region ( Fig. 3 ). The second-phase intermetallic located at the grain boundaries had...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.process.c9001439
EISBN: 978-1-62708-235-8
..., leaving a weak, porous residual structure. The brazing alloy was of type CP 1 as covered by BS 1845. Header and tube materials were basically copper-nickel alloys for which the use of a phosphorus bearing brazing alloy is not recommended owing to the possibility of forming the brittle intermetallic...
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
... at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis...
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.modes.c9001734
EISBN: 978-1-62708-234-1
.... Fig. 3 Grain boundary melting and particles on grain surfaces characterize fracture away from center of failure. Magnification 840 times. Other three-dimensional features were seen; these were probably intermetallics left with some grains when the fracture or separation occurred...
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Published: 01 December 1992
Fig. 3 Backscatter electron micrograph of the MCC away from the hot-gas wall, showing normal microstructure with clean grain boundaries and second-phase intermetallics with a composition of Cu-10Ag-22Zr. 236×. More
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Published: 01 December 1992
Fig. 4 Micrographs of the banded region of the MCC. (a) Cracking and grain-boundary separation, back scatter mode. 296×. (b) Dissociated intermetallics with compositions of 52 to 60% Cu, l2 to 15% Ag, and 27 to 32%.Zr.1480×. More