This article presents tools, techniques, and procedures that engineers and material scientists can use to investigate plastic part failures. It also provides a brief survey of polymer systems and the key properties that need to be measured during failure analysis. It describes the characterization of plastics by infrared and nuclear magnetic resonance spectroscopy, differential scanning calorimetry, differential thermal analysis, thermogravimetric analysis, thermomechanical analysis, and dynamic mechanical analysis. The article also discusses the use of X-ray diffraction for analyzing crystal phases and structures in solid materials.

The goal of using nondestructive evaluation (NDE) in conjunction with failure analysis is to obtain the most comprehensive set of data in order to characterize the details of the damage and determine the factors that allowed the damage to occur. The NDE results can be used to determine optimal areas upon which to focus for sectioning and metallography in order to further investigate the condition of the component. This article provides information on the inspection method available for failure analysis, including standard methods such as visual testing, penetrant testing, and magnetic particle testing. It covers the effects of various factors on the properties of the part that may impact failure analysis, describes the characterization of damage modes and crack sizes, and finally discusses the processes involved in application of NDE results to failure analysis.

X-ray spectroscopy is generally accepted as the most useful ancillary technique that can be added to any scanning electron microscope (SEM), even to the point of being considered a necessity by most operators. While “stand-alone” x-ray detection systems are used less frequently in failure analysis than the more exact instrumentation employed in SEMs, the technology is advancing and is worthy of note due to its capability for nondestructive analysis and application in the field. This article begins with information on the basis of the x-ray signal. This is followed by information on the operating principles and applications of detectors for x-ray spectroscopy, namely energy-dispersive spectrometers, wavelength-dispersive spectrometers, and handheld x-ray fluorescence systems. The processes involved in x-ray analysis in the SEM and handheld x-ray fluorescence analysis are then covered. The article ends with a discussion on the applications of x-ray spectroscopy in failure analysis.

Friction and wear are important when considering the operation and efficiency of components and mechanical systems. Among the different types and mechanisms of wear, adhesive wear is very serious. Adhesion results in a high coefficient of friction as well as in serious damage to the contacting surfaces. In extreme cases, it may lead to complete prevention of sliding; as such, adhesive wear represents one of the fundamental causes of failure for most metal sliding contacts, accounting for approximately 70% of typical component failures. This article discusses the mechanism and failure modes of adhesive wear including scoring, scuffing, seizure, and galling, and describes the processes involved in classic laboratory-type and standardized tests for the evaluation of adhesive wear. It includes information on standardized galling tests, twist compression, slider-on-flat-surface, load-scanning, and scratch tests. After a discussion on gear scuffing, information on the material-dependent adhesive wear and factors preventing adhesive wear is provided.

Failure analysis is a process that is performed in order to determine the causes or factors that have led to an undesired loss of functionality. This article is intended to demonstrate proper approaches to failure analysis work. The goal of the proper approach is to allow the most useful and relevant information to be obtained. The discussion covers the principles and approaches in failure analysis work, objectives and scopes of failure analysis, the planning stages for failure analysis, the preparation of a protocol for a failure analysis, practices used by failure analysts, and procedures of failure analysis.

This article discusses the organization required at the outset of a failure investigation and provides a methodology with some organizational tools. It focuses on the use of problem-solving tools such as a fault tree analysis combined with critical thinking. The discussion covers nine steps to organize a good failure investigation. They are as follows: understand and negotiate goals of the investigation, obtain a clear understanding of the failure, identify all possible root causes, objectively evaluate the likelihood of each root cause, converge on the most likely root cause(s), objectively and clearly identify all possible corrective actions, objectively evaluate each corrective action, select optimal corrective action(s), and evaluate effectiveness of selected corrective action(s). Common problems detrimental to a failure investigation are also covered.

The principal task of a failure analyst during a physical-cause investigation is to identify the sequence of events involved in the failure. Technical skills and tools are required for such identification, but the analyst also needs a mental organizational framework that helps evaluate the significance of observations. This article discusses the processes involved in the characterization and identification of damage and damage mechanisms. It describes the relationships between damage causes, mechanisms, and modes with examples. In addition, some of the more prevalent and encompassing characterization approaches and categorization methods of damage mechanism are also covered.

Examination of a damaged component involves a chain of activities that, first and foremost, requires good observation and documentation. Following receipt and documentation, the features of damage can be recorded and their cause(s) investigated, as this article briefly describes, for typical types of damage experienced for metallic components. This article discusses the processes involved in visual or macroscopic examination of damaged material; the interpretation of fracture features, corrosion, and wear damage features; and the analysis of base material composition. It covers the processes involved in the selection of metallurgical samples, the preparation and examination of metallographic specimens in failure analysis, and the analysis and interpretation of microstructures. Examination and evaluation of polymers and ceramic materials in failure analysis are also briefly discussed.

Chemical analysis is a critical part of any failure investigation. With the right planning and proper analytical equipment, a myriad of information can be obtained from a sample. This article presents a high-level introduction to techniques often used for chemical analysis during failure analysis. It describes the general considerations for bulk and microscale chemical analysis in failure analysis, the most effective techniques to use for organic or inorganic materials, and examples of using these techniques. The article discusses the processes involved in the chemical analysis of nonmetallics. Advances in chemical analysis methods for failure analysis are also covered.

Visual examination, using the unaided eye or a low-power optical magnifier, is typically one of the first steps in a failure investigation. This article presents the guidelines for selecting samples for scanning electron microscope examination and optical metallography and for cleaning fracture surfaces. It discusses damage characterization of metals, covering various factors that influence the damage, namely stress, aggressive environment, temperature, and discontinuities.

This article describes concepts and tools that can be used by the failure analyst to understand and address deformation, cracking, or fracture after a stress-related failure has occurred. Issues related to the determination and use of stress are detailed. Stress is defined, and a procedure to deal with stress by determining maximum values through stress transformation is described. The article provides the stress analysis equations of typical component geometries and discusses some of the implications of the stress analysis relative to failure in components. It focuses on linear elastic fracture mechanics analysis, with some mention of elastic-plastic fracture mechanics analysis. The article describes the probabilistic aspects of fatigue and fracture. Information on crack-growth simulation of the material is also provided.

Failure analysis is generally defined as the investigation and analysis of parts or structures that have failed or appeared to have failed to perform their intended duty. Methods of field inspection and initial examination are also critical factors for both reconstruction analysts and materials failure analysts. This article focuses on the general methods and approaches from the perspective of a reconstruction analyst. It describes the elements of accident reconstruction, which have conceptual similarity with the principles for failure analysis of material incidents that are less complex than a large-scale accident. The approach presented is that the analysis and reconstruction is based on the physical evidence. The article provides a brief review of some general concepts on the use and limitations of advanced data acquisition tools and computer modeling. Legal implications of destructive testing are discussed in detail.

As a failure investigation progresses, the time arrives when the data and results of the various testing and analyses are compiled, compared, and interpreted. Data interpretation should be relatively straightforward for results that align well. However, interpretation can be challenging when results from various tests seem contradictory or inconclusive. Regardless, conclusions must eventually be drawn from the data. This article discusses the processes involved in reviewing data, formulating conclusions, failure analysis report preparation and writing, and providing recommendations and follow-up with appropriate personnel to prevent future failures.

Failure analysis is an investigative process that uses visual observations of features present on a failed component fracture surface combined with component and environmental conditions to determine the root cause of a failure. The primary means of recording the conditions and features observed during a failure analysis investigation is photography. Failure analysis photographic imaging is a combination of both science and art; experience and proper imaging techniques are required to produce an accurate and meaningful fracture surface photograph. This article reviews photographic principles and techniques as applied to failure analysis, both in the field and in the laboratory. The discussion covers the processes involved in field and laboratory photographic documentations, provides a description of professional digital cameras, and gives information on photographic lighting and microscopic photography. Special techniques can be employed to deal with highly reflective conditions and are also described in this article.

Nondestructive testing (NDT), also known as nondestructive evaluation (NDE), includes various techniques to characterize materials without damage. This article focuses on the typical NDE techniques that may be considered when conducting a failure investigation. The article begins with discussion about the concept of the probability of detection (POD), on which the statistical reliability of crack detection is based. The coverage includes the various methods of surface inspection, including visual-examination tools, scanning technology in dimensional metrology, and the common methods of detecting surface discontinuities by magnetic-particle inspection, liquid penetrant inspection, and eddy-current testing. The major NDE methods for internal (volumetric) inspection in failure analysis also are described.

Identification of alloys using quantitative chemical analysis is an essential step during a metallurgical failure analysis process. There are several methods available for quantitative analysis of metal alloys, and the analyst should carefully approach selection of the method used. The choice of appropriate analytical techniques is determined by the specific chemical information required, the condition of the sample, and any limitations imposed by interested parties. This article discusses some of the commonly used quantitative chemical analysis techniques for metals. The discussion covers the operating principles, applications, advantages, and disadvantages of optical emission spectroscopy (OES), inductively coupled plasma optical emission spectroscopy (ICP-OES), X-ray spectroscopy, and ion chromatography (IC). In addition, information on combustion analysis and inert gas fusion analysis is provided.

Metallographic examination is one of the most important procedures used by metallurgists in failure analysis. Typically, the light microscope (LM) is used to assess the nature of the material microstructure and its influence on the failure mechanism. Microstructural examination can be performed with the scanning electron microscope (SEM) over the same magnification range as the LM, but examination with the latter is more efficient. This article describes the major operations in the preparation of metallographic specimens, namely sectioning, mounting, grinding, polishing, and etching. The influence of microstructures on the failure of a material is discussed and examples of such work are given to illustrate the value of light microscopy. In addition, information on heat-treatment-related failures, fabrication-/machining-related failures, and service failures is provided, with examples created using light microscopy.

The scanning electron microscope (SEM) is one of the most versatile instruments for investigating the microscopic features of most solid materials. The SEM provides the user with an unparalleled ability to observe and quantify the surface of a sample. This article discusses the development of SEM technology and operating principles of basic systems of SEM. The basic systems covered include the electron optical column, signal detection and display equipment, and the vacuum system. The processes involved in the preparation of samples for observation using an SEM are described, and the application of SEM in fractography is discussed. The article covers the failure mechanisms of ductile failure, brittle failure, mixed-mode failure, and fatigue failure. Lastly, image dependence on microscope type and operating parameters is also discussed.

This article covers the three most popular techniques used to characterize the very outermost layers of solid surfaces: Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and time-of-flight secondary ion mass spectrometry (TOF-SIMS). Some of the more important attributes are listed for preliminary insight into the strengths and limitations of these techniques for chemical characterization of surfaces. The article describes the basic theory behind each of the different techniques, the types of data produced from each, and some typical applications. Also discussed are the different types of samples that can be analyzed and the special sample-handling procedures that must be implemented when preparing to do failure analysis using these surface-sensitive techniques. Data obtained from different material defects are presented for each of the techniques. The examples presented highlight the typical data sets and strengths of each technique.

Engineering component and structure failures manifest through many mechanisms but are most often associated with fracture in one or more forms. This article introduces the subject of fractography and aspects of how it is used in failure analysis. The basic types of fracture processes (ductile, brittle, fatigue, and creep) are described briefly, principally in terms of fracture appearances. A description of the surface, structure, and behavior of each fracture process is also included. The article provides a framework from which a prospective analyst can begin to study the fracture of a component of interest in a failure investigation. Details on the mechanisms of deformation, brittle transgranular fracture, intergranular fracture, fatigue fracture, and environmentally affected fracture are also provided.