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Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
Abstract
Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.chem.c9001441
EISBN: 978-1-62708-220-4
Abstract
Soft-soldered copper pipe joints used in refrigerating plants failed. The solder had not adhered uniformly to the pipe surface. In addition, there were some longitudinal grooves on the pipe surfaces, parts of which were not filled with solder. The unsoldered areas formed cavities within the joints, some of which had been in direct communication with the outsides via the grooves or interconnected cavities. On cooling, moisture condensed on the external surfaces. Some of this was drawn by capillary action into the cavities in open communication with the external surface. On continued cooling to below freezing-point, water that entered the cavities solidified. This was accompanied by a slight increase in volume, which collapsed the pipe walls. In the examples, the pipe ends had not been properly tinned. The solder used was found to be of the tin-antimony type, containing about 5% antimony, which is more difficult to use than the usual tin-lead alloys. The use of this particular type of solder was a contributory factor in the production of unsound joints in the samples examined.
Series: ASM Failure Analysis Case Histories
Publisher: ASM International
Published: 01 June 2019
DOI: 10.31399/asm.fach.steel.c9001234
EISBN: 978-1-62708-232-7
Abstract
In a copper hot water system, a bent pipe was soldered into a straight pipe with twice the diameter. The neighborhood of the soldered joint was covered with corrosion product predominantly blue-green in color, presumably carbonates. When these corrosion products were scratched off it was seen that the copper beneath this layer had not suffered noticeable attack. The object of the examination was the localized deep cavities located almost symmetrically to both sides of the inserted end of the narrower tube on the internal wall of the wider tube which had in one place been eaten right through. The symmetrical location on each side of the point of insertion of the narrower pipe and the localized sharp delineation of the attack indicated erosion due to the formation of turbulence. By avoiding sharp transitions and abrupt changes in cross section it is possible to design the pipe work so that localized turbulence is obviated. Degassing and cleansing of the water also would reduce the danger of erosion particularly in the case of softened water, which takes up oxygen and carbon dioxide very readily thus becoming particularly aggressive.