The paper discusses the analysis of a coating defect on a high phosphorus electroless nickel (Ni-11 wt. % P) deposit plated on an aluminum alloy substrate. Preliminary investigations had indicated that the elongated defects were possibly caused by the entrapment of long fibers or particles during the plating. The possible sources of fibers were identified. The SEM/EDS analysis of fibers collected from the air duct filters correlated very well with the defect shape and the EDS profile collected from under the defect site. It appears that the fibers from air duct filters directly above the plating line were blown into the plating tank and getting co-deposited. The paper describes the step-by-step analysis of the defect that led to successful identification of the root cause of the defect.

An open electrical circuit was found between plated through-holes in a six-layer printed circuit board after thermal cycling. The copper plating was very thin in the failure area but did make an electrical contact during initial testing. During thermal cycling, differential z-expansion between the epoxy board and copper caused the thin plating to crack. During electrical testing of a four-layer circuit board, an open electrical circuit was found between the plated through-holes. Plating discontinuity was caused by poor drilling using a dull drill with improper speed (rpm) and/or feed rate as was observed by nonuniform plating and nodule formation in the plated layer. In a third example, an open electrical circuit was found in a six-layer board between two adjacent plated through-holes. A plating void was on one side of the conductor joining the two holes. Continuity was found when tested from one side of the board but lost when tested from the other. In a fourth case, an open circuit found between a plated through-hole and contact pad on a six-layer printed circuit board was caused by an etching defect.

Electroless nickel plating separation from copper alloy CDA175 retaining clips used on printed circuit boards was caused by a copper oxide layer that reduced adhesion of the nickel plating on the clips. Stresses that developed during module insertion caused flaking to occur at the oxidized copper surface. Electroless nickel plating separation from OFHC copper leads was caused by improper handling rather than a plating anomaly per se. Tin plating separation from copper underplating on a hybrid package lid occurred because of a four-week delay between the copper plating and tin plating steps. It was recommended that tin plating should follow the copper underplating within 24 h and a cleaning step of bright dipping after copper plating be performed.

Cartridge-pneumatic starter systems are used on military aircraft. In the cartridge mode used for alert starts, the starter turbine is driven by hot gases produced through the controlled burning of a solid propellant cartridge within a closed chamber (the breech chamber/cartridge chamber assembly). Premature failures of steel breech chambers have been prevalent enough to cause serious concern. The breech chamber is fabricated from a 4340 Ni-Cr-Mo steel forging heat treated to a hardness in the range HRC 40 to 45. The failures have taken several forms, including fracture and unzipping of the chamber dome, burn-through of the dome, and shearing of bayonet locking lugs. Factors identified as significant in the failures are the pressure developed in the chamber and internal corrosion of the chamber in an environment that can produce stress-corrosion cracking. The interior configuration of the chamber and the stress distribution also have a bearing upon the failure modes. Several failures are reviewed to illustrate the problems.